Patent classifications
H04N23/52
LENS MODULE AND MANUFACTURING METHOD THEREOF
A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.
VEHICULAR CAMERA DEVICE
In a vehicle camera device, a camera is housed inside a bracket of a base, and a stud bolt of the base is connected to a side door. Heat generated by the camera is transferred to the side door via the bracket, the base, and the stud bolt. Therefore, the heat generated by the camera can be efficiently released from the camera.
HEAT MITIGATION FOR REARVIEW ASSEMBLY
A system for controlling temperatures within a rearview assembly may comprise a rearview assembly having a housing defining an opening and at least one of a display element and an electro-optic element disposed in the opening; and an in-cabin monitoring system comprising at least one printed circuit board; an imager disposed on one of the at least one printed circuit boards, an image signal processor in communication with the imager, at least one light source, and at least one heat spreader positioned within the housing. The heat spreader may be stamped aluminum. The imager may be at a distance from the at least one light source.
SUPERHYDROPHOBIC SURFACE IN THERMAL INFRARED IMAGING DEVICE
Various techniques are provided for prevent excessive accumulation of moisture onto a surface of an optical component of an imaging device. In one example, a method includes providing a bulk layer of an optical component of a thermal imaging system, wherein the bulk layer is configured to pass thermal radiation. The method further includes depositing a diamond like coating (DLC) to provide an external surface of the optical component, wherein the DLC exhibits a resistance to abrasion. The method further includes forming a plurality of nanostructures in the optical component, wherein the nanostructures exhibit a superhydrophobic property to prevent excessive moisture accumulation on the external surface of the optical component. Additional methods and systems are also provided.
Dual camera module and optical device
The present embodiment relates to a dual camera module comprising a first camera module and a second camera module, wherein: a first magnet unit of the first camera module includes a first magnet and a second magnet, both disposed opposite to each other on a side surface of a first housing; a second magnet unit of the second camera module includes a third to a sixth magnet arranged on four respective corners of a second housing; a third magnet unit is disposed on a side surface of the first housing facing the second housing; the third magnet unit is disposed between the first magnet and the second magnet; and the third magnet unit is smaller than the first magnet and is disposed on a virtual line connecting an optical axis of the first camera module and an optical axis of the second camera module.
Intelligent roadside unit
The present disclosure provides an intelligent roadside unit. The intelligent roadside unit includes: a radar configured to detect an obstacle within a first preset range of the intelligent roadside unit; a camera configured to capture an image of a second preset range of the intelligent roadside unit; a master processor coupled to the radar and the camera, and configured to generate a point cloud image according to information on the obstacle detected by the radar and the image detected by the camera; and a slave processor coupled to the radar and the camera, and configured to generate a point cloud image according to the information on the obstacle detected by the radar and the image detected by the camera, in which the slave processor checks the master processor, and when the original master processor breaks down, it is switched from the master processor to the slave processor.
Hybrid sensor shift platform
A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.
Camera module with improved heat dissipation function and electronic device
The camera module with improved heat dissipation function include a base, a photosensitive chip, a circuit board; and a heat conducting sheet. Wherein the base comprises a first surface and a second surface opposite to the first surface. A portion of the first surface is recessed to form a third surface between the first surface and the second surface, and to form a plurality of sidewalls connecting the first surface and the third surface, the third surface and the plurality of sidewalls cooperatively define a slot. Wherein the photosensitive chip is fixed on the third surface and accommodated in the slot; the circuit board is fixed on the first surface. A gap is defined between the circuit board and the photosensitive chip; the heat conducting sheet is disposed in the gap.
IMAGING DEVICE
An imaging device according to the present disclosure includes a housing, a lens unit, a heater, an imaging unit, a temperature sensor, and a heater control unit. The lens unit is attached to the housing. The heater is provided in the lens unit. The imaging unit, the temperature sensor, and the heater control unit are housed in the housing. The imaging unit outputs an optical image formed by a light flux transmitted through the lens unit as an image signal. The heater control unit controls the heater in accordance with a temperature detection value by the temperature sensor.
LENS CAP AND METHOD FOR AUTOMATIC RECOGNITION OF THE SAME
A visual sensor having a light sensitive element and a processor, the processor being adapted to recognize whether a cap is on or off the light sensitive element by recognizing a unique identification pattern coded into the light sensitive element.