A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first transparent plate, an image sensor, and a first plastic member. The base assembly includes a substrate having a main body that includes a metal material. The first transparent plate is located on the first side of the base assembly. The image sensor is located on the second side of the base assembly and adjacent to the main body, wherein the first side is opposite the second side. The substrate is disposed between the image sensor and the first transparent plate. The first plastic member is connected to the base assembly. The image sensor is surrounded by the first plastic member. When the photosensitive module receives light, the light passes through the first transparent plate and an opening of the main body sequentially to the image sensor.

An image capturing apparatus includes an image sensor unit having an image sensor in a state swingable within a plane orthogonal to an image capturing optical axis, a cooling plate connected to the image sensor unit, and a heat dissipation unit attached to a rear side plate. The heat dissipation unit includes a heat dissipation rubber movable in the image capturing optical axis direction between a contact position in contact with the cooling plate and a spaced position spaced from the cooling plate, and a graphite sheet that connects between the heat dissipation rubber and a heat dissipation plate. In the contact position of the heat dissipation rubber, heat from the image sensor is transferred to the rear side plate via the cooling plate, the heat dissipation rubber, the graphite sheet, and the heat dissipation plate.

An image capturing apparatus includes an image sensor unit having an image sensor in a state swingable within a plane orthogonal to an image capturing optical axis, a cooling plate connected to the image sensor unit, and a heat dissipation unit attached to a rear side plate. The heat dissipation unit includes a heat dissipation rubber movable in the image capturing optical axis direction between a contact position in contact with the cooling plate and a spaced position spaced from the cooling plate, and a graphite sheet that connects between the heat dissipation rubber and a heat dissipation plate. In the contact position of the heat dissipation rubber, heat from the image sensor is transferred to the rear side plate via the cooling plate, the heat dissipation rubber, the graphite sheet, and the heat dissipation plate.

An image capture device including first and second heatsinks and a printed circuit board that separates the first and second heatsinks and includes a processor configured to generate heat. The image capture device includes a conductor assembly that is configured to transfer heat by conduction and extends between the first heatsink, the processor, and the second heatsink.

An image capture device including first and second heatsinks and a printed circuit board that separates the first and second heatsinks and includes a processor configured to generate heat. The image capture device includes a conductor assembly that is configured to transfer heat by conduction and extends between the first heatsink, the processor, and the second heatsink.

The embodiments of the present application relates to a camera, comprising a first housing, a stitching lens mechanism, and a driving assembly. The stitching lens mechanism is mounted in the first housing, and the stitching lens mechanism comprises at least two first assemblies, the first lens assembly comprises a first lens, a first included angle is formed between at least two first lenses. A driving assembly is connected to the first lens assembly through a rotating assembly. At least two first lenses are distributed in a first plane, the first housing is rotatably arranged in a second plane, and the second plane is perpendicular to the first plane. Each of the first lens assemblies takes pictures in different orientations for the same scene, so that the imaging field of view is larger. So that the first housing can rotate under the drive of the driving assembly, that is, the stitching lens mechanism can rotate. Compared with the existing stitching camera with a fixed structure, the imaging field of view of the camera of the present application is larger. That is, the camera of the present application can further expand the range of the imaging field of view compared to the existing camera.

An electronic system including a camera module comprises a camera module on a metal plate, a metal flange surrounding the camera module, a metal frame connected to the metal flange, and a first adhesion member between the metal flange and the metal plate. The camera module includes a substrate including a cavity, an image sensor in the cavity, and a lens assembly on the image sensor. An area of the metal plate is greater than that of the substrate, from a plan view. The metal plate includes a first part overlapping the substrate from the plan view, and a second part not overlapping the substrate from the plan view. The second part corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second part of the metal plate contact the first adhesion member.

An electronic system including a camera module comprises a camera module on a metal plate, a metal flange surrounding the camera module, a metal frame connected to the metal flange, and a first adhesion member between the metal flange and the metal plate. The camera module includes a substrate including a cavity, an image sensor in the cavity, and a lens assembly on the image sensor. An area of the metal plate is greater than that of the substrate, from a plan view. The metal plate includes a first part overlapping the substrate from the plan view, and a second part not overlapping the substrate from the plan view. The second part corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second part of the metal plate contact the first adhesion member.

A sensor module according to an embodiment of the present technology includes a sensor element, a first case, a second case, and an intermediate layer. The first case includes an opening end and accommodates therein the sensor element. The second case includes a joining surface welded to the opening end. The intermediate layer is reflective of light, and is formed along an outer peripheral edge of a region, in the opening end, in which the opening end faces the joining surface.

A sensor module according to an embodiment of the present technology includes a sensor element, a first case, a second case, and an intermediate layer. The first case includes an opening end and accommodates therein the sensor element. The second case includes a joining surface welded to the opening end. The intermediate layer is reflective of light, and is formed along an outer peripheral edge of a region, in the opening end, in which the opening end faces the joining surface.