An imaging system includes an array of photodetectors configured to produce an array of intensity values corresponding to light intensity at the photodetectors. The imaging system can include a display for display images acquired with the array of photodetectors, after some image and display processing. The image and display processing components of the imaging system produce an array of display-formatted pixels for display on the imaging system display. The display-formatted pixels include at least a first plurality of pixels formatted for display using a first lookup table and a second plurality of pixels formatted for display using a second lookup table. Threshold criteria for choosing which pixels belong to which plurality are determined from analysis of a scene indicated by a user as a background scene. Once the threshold criteria are determined from the background the criteria are applied to pixels in subsequent image frames, and the pixels that meet the criteria are displayed in at least one color table LUT and the pixels that do not are displayed in a at least one different color table LUT. In a particular embodiment. The criteria may be above or below the max scene value (or temperature) from the background scene and pixels below the criteria may be displayed in a monochrome or non-vivid color table and pixels above the criteria are displayed in a vivid color table.

Depth sensors comprising a focal plane array with photosites (PSs) directed in different directions, each PS operable to detect light arriving from an instantaneous field of view (IFOV) of the PS, a readout-set of readout circuitries (ROCs), each ROC coupled to readout-group PSs by multiple switches and operable to output an electric signal indicative of an amount of light impinging on the readout-group PSs when the read-out group is connected to the respective ROC via at least one of the switches, a controller operable to change switching states of the switches, such that at different times different ROCs of the readout-set are coupled to the readout-group and are exposed to reflections from different distances, and a processor operable to obtain the electric signals from the readout-set indicative of detected levels of reflected light collected from the IFOVs of the readout-group and to determine depth information for an object.

Depth sensors comprising a focal plane array with photosites (PSs) directed in different directions, each PS operable to detect light arriving from an instantaneous field of view (IFOV) of the PS, a readout-set of readout circuitries (ROCs), each ROC coupled to readout-group PSs by multiple switches and operable to output an electric signal indicative of an amount of light impinging on the readout-group PSs when the read-out group is connected to the respective ROC via at least one of the switches, a controller operable to change switching states of the switches, such that at different times different ROCs of the readout-set are coupled to the readout-group and are exposed to reflections from different distances, and a processor operable to obtain the electric signals from the readout-set indicative of detected levels of reflected light collected from the IFOVs of the readout-group and to determine depth information for an object.

A thermal imaging device having a scan mechanism operable to effectuate sequentially predetermined offsets, each configured between a thermal image of thermal radiations in a defined area on an imaging plane and an array of micro mirrors configured on a substrate. A respective image of a light pattern of a light beam reflected by a light reflection portion of each respective micro mirror in the array can be captured, when a rotation of the respective micro mirror, caused by radiation incident on a radiation absorption surface of the respective micro mirror, is stabilized at a respective offset. After computing a respective measurement of intensity measured by the respective micro mirror based on the respective image captured for the respective offset, a processor computes measurements of intensity of radiation in sub-areas of the thermal image, from measurements of intensity for the predetermined offsets, to generate a high resolution output.

A thermal imaging device having a scan mechanism operable to effectuate sequentially predetermined offsets, each configured between a thermal image of thermal radiations in a defined area on an imaging plane and an array of micro mirrors configured on a substrate. A respective image of a light pattern of a light beam reflected by a light reflection portion of each respective micro mirror in the array can be captured, when a rotation of the respective micro mirror, caused by radiation incident on a radiation absorption surface of the respective micro mirror, is stabilized at a respective offset. After computing a respective measurement of intensity measured by the respective micro mirror based on the respective image captured for the respective offset, a processor computes measurements of intensity of radiation in sub-areas of the thermal image, from measurements of intensity for the predetermined offsets, to generate a high resolution output.

Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

A sensor module including at least one brightness sensor element for detecting a brightness of a wideband electromagnetic radiation and at least one color sensor field, which includes at least one color sensor element for detecting a color of the electromagnetic radiation. The brightness sensor element has a larger sensor surface than the color sensor field.

Techniques for reducing a likelihood of detection of an imaging system by another imaging system are provided. For example, a mechanism may be used to interrupt an optical path between pulse biased thermal sensors and an aperture of the system when the pulsed biased thermal sensors are pulse biased. For example, emissions may be directed to a beam dump. Other techniques may include a mechanism for linearly moving the thermal sensor array or rotating a mirror.

Techniques for reducing a likelihood of detection of an imaging system by another imaging system are provided. For example, a mechanism may be used to interrupt an optical path between pulse biased thermal sensors and an aperture of the system when the pulsed biased thermal sensors are pulse biased. For example, emissions may be directed to a beam dump. Other techniques may include a mechanism for linearly moving the thermal sensor array or rotating a mirror.