Techniques are disclosed for imager health monitoring systems and methods. In one example, a method includes determining a characteristic of an active unit cell of a focal plane array (FPA) and/or a reference unit cell of the FPA. The active unit cell includes a detector selectively shielded from an incident scene. The reference unit cell includes a reference detector shielded from the incident scene. The method further includes determining a state of the FPA based at least in part on the characteristic. The method further includes transmitting an indication of the state of the FPA to selectively cause adjustment of the FPA Related devices and systems are also provided.

Techniques are disclosed for imager health monitoring systems and methods. In one example, a method includes determining a characteristic of an active unit cell of a focal plane array (FPA) and/or a reference unit cell of the FPA. The active unit cell includes a detector selectively shielded from an incident scene. The reference unit cell includes a reference detector shielded from the incident scene. The method further includes determining a state of the FPA based at least in part on the characteristic. The method further includes transmitting an indication of the state of the FPA to selectively cause adjustment of the FPA Related devices and systems are also provided.

A method for manufacturing an electronic device includes a stretchable member attachment step of attaching stretchable member 21 to first substrate 2 on which second substrate 3 is stacked, a first modification line formation step of forming one or more first modification lines 22 by irradiating the first substrate 2 with a laser beam, and a dividing step of stretching the stretchable member 21 to divide the first substrate 2 along the one or more first modification lines 22.

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

The invention concerns a method of image processing involving: receiving, by a processing device, an input image (IB) captured by a pixel array sensitive to infrared radiation; determining, based on the input image and on a column component vector (VCOL), a first scale factor (?) by estimating a level of the column spread present in the input image; generating column offset values (?.VCOL(y)) based on the product of the first scale factor with the values of the vector; determining, based on the input image and on a 2D dispersion matrix (IDISP), a second scale factor (?) by estimating a level of the 2D dispersion present in the input image; generating pixel offset values (?.IDISP(x,y)) based on the product of the second scale factor with the values of the matrix; and generating a corrected image (IC) by applying the column and pixel offset values.

In one embodiment, a method for displaying a panoramic view image includes transmitting video data from a plurality of sensors to a data processor and using the processor to stitch the video data from respective ones of the sensors into a single panoramic image. A focus view of the image is defined and the panoramic image is scrolled such that the focus view is centered in the display. A high resolution camera is aimed along a line corresponding to a center of the focus view of the image and an image produced by the camera is stitched into the panoramic image. A mapping function is applied to the image data to compress the data and thereby reduce at least the horizontal resolution of the image in regions adjacent to the side edges thereof.

An infrared detection apparatus includes an infrared detector configured to output an electric signal corresponding to an inputted infrared ray, and a signal processor configured to compensate for a variation of the electric signal, which is outputted from the infrared detector, caused by variation of an operation temperature with a value indicating a variation of a dark current equivalent component by the operation temperature variation when becoming a second operation temperature after the operation temperature variation, the dark current equivalent component including a first dark current equivalent component calculated using a first electric signal and a second electric signal outputted from the infrared detector when infrared rays having intensities equivalent to blackbodies of a first known temperature and a second known temperature are inputted at a first operation temperature.

In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.

A photodetector interface circuit is described, residing partially or fully within a unit cell per pixel of an FPA. The interface circuit uses an innovative approach to providing pixel level digitization for full frame integration times while maintaining the ability to use integration capacitors of practical sizes. The technique uses successive charge subtraction, removing charge from an integration capacitor successively, triggered by the charge increasing sufficiently to charge the integrator to a reference level, thereby triggering both charge removal and incrementing a count, until all of the current flowing in the photodetector has been accounted for and the count represents the digitization of the photodetector signal. Various options on how to arrange the digitization elements are also disclosed.