Pixel sensitivity is improved in a solid-state imaging element that performs time delay integration.

The solid-state imaging element includes a plurality of photoelectric conversion elements and a given number of transistors. In the solid-state imaging element, the plurality of photoelectric conversion elements is arranged along a given direction with a given spacing. A size, in the given direction, of each of the plurality of photoelectric conversion elements that are arranged with the given spacing does not exceed the given spacing. Also, in the solid-state imaging element, the given number of transistors are arranged between the plurality of photoelectric conversion elements, and the transistors generate a signal commensurate with as amount of charge generated by any of the plurality of photoelectric conversion elements.

A flicker detection circuit is provided. The flicker detection circuit may include a flicker detection correlated double sampling (FD CDS) circuit including first to sixth switches turned on or off based on a control signal, and first to fourth capacitors, the FD CDS circuit being configured to receive a flicker pixel signal output from at least one pixel, summate with an output offset signal, and amplify the summation based on a gain to form a flicker detection signal; and an analog-to-digital converter (ADC) configured to quantize the flicker detection signal.

A technique capable of improving linearity at a low illuminance is provided. A solid-state sensing image device includes: a pixel array including a plurality pixels arranged in a matrix form and a plurality of pixel signal lines connected to the plurality of pixels and receiving pixel signals supplied from the plurality pixels; a column-parallel A/D converting circuit connected to the plurality of pixel signal lines; and a reference-voltage generating circuit generating ramp-wave reference voltage that linearly changes in accordance with time passage. The column-parallel A/D converting circuit includes a first A/D converter, the first A/D converter includes: a first input terminal connected to the pixel signal line; a second input terminal receiving the reference voltage; and an offset generating circuit connected to the first input terminal and generating an offset voltage for the first input terminal.

A solid state imaging apparatus includes an insulation structure formed of an insulation substance penetrating through at least a silicon layer at a light receiving surface side, the insulation structure having a forward tapered shape where a top diameter at an upper portion of the light receiving surface side of the silicon layer is greater than a bottom diameter at a bottom portion of the silicon layer. Also, there are provided a method of producing the solid state imaging apparatus and an electronic device including the solid state imaging apparatus.

An imaging element of the present disclosure includes an analog-to-digital converter configured to convert multiple analog pixel signals that are acquired under multiple imaging conditions different from each other and that are output from a pixel, to multiple digital pixel signals, a threshold setting unit configured to set, on an input side of the analog-to-digital converter, a threshold that is randomly varied, a comparison unit configured to use, as a comparison threshold, the threshold set by the threshold setting unit and compare the comparison threshold with one of the multiple analog pixel signals, and a selection unit configured to select and output, on the basis of a result of comparison from the comparison unit, one of the multiple digital pixel signals that are output from the analog-to-digital converter.

An imaging element includes a first substrate that is provided with a photoelectric conversion unit which generates an electric charge by photoelectric conversion, a signal line to which a signal based on the electric charge generated by the photoelectric conversion unit is output, and a supply unit which supplies a voltage to the signal line such that a voltage of the signal line does not fall below a predetermined voltage, and a second substrate that is provided with a processing unit which processes the signal output to the signal line and is stacked on the first substrate.

To make it possible to reduce power consumption in a charge pump that supplies driving power to a pixel array. An imaging element (4) according to an embodiment includes: an imaging unit (100) in which pixels (10) including a light receiving element are arrayed, a drive unit (112) that generates a drive signal for driving the pixels, a charge pump circuit (122) that generates electric power for driving the drive unit, and a control unit (120) that controls, according to operation of the imaging unit, a driving capability of the charge pump circuit to drive the drive unit.

Some embodiments include a system, comprising: a plurality of pixels; a plurality of data lines coupled to the pixels; a plurality of switches coupling the pixels to the data lines; a plurality of readout circuits coupled to the data lines; control logic coupled to the readout circuits, the control logic configured to, for one of the pixels: acquire a first value for the pixel while the corresponding switch is in an off state; reset the corresponding readout circuit corresponding for the pixel; acquire a second value for the pixel after resetting the readout circuit; turn on the corresponding switch; acquire a third value for the pixel after turning on the corresponding switch; and combine the first value, the second value, and the third value into a combined value for the pixel.

Correlated double sampling column-level readout of an image sensor pixel may be provided by a charge transfer amplifier that is configured and operated to itself provide for both correlated-double-sampling and amplification of floating diffusion potentials read out from the pixel onto a column bus after reset of the floating diffusion (I) but before transferring photocharge to the floating diffusion (the reset potential) and (ii) after transferring photocharge to the floating diffusion (the transfer potential). A common capacitor of the charge transfer amplifier may sample both the reset potential and the transfer potential such that a change in potential (and corresponding charge change) on the capacitor represents the difference between the transfer potential and reset potential, and the magnitude of this change is amplified by the charge change being transferred between the common capacitor and a second capacitor selectively coupled to the common capacitor.

An imaging device includes a photoelectric converter that converts light into signal charge, a charge accumulation region that accumulates the signal charge, a first transistor having a gate connected to the charge accumulation region, and a common gate amplifier circuit that amplifies an output of the first transistor to output to the charge accumulation region. The common gate amplifier circuit includes a second transistor. One of a source and a drain of the second transistor is connected to one of a source and a drain of the first transistor, and the other of the source and the drain of the second transistor is connected to the charge accumulation region.