A pixel binning method for processing pixel data acquired from an image sensor comprising a pixel array, the pixel binning method includes performing a first scanning process that is to scan a sensing area of the image sensor, to obtain a first number of pixel data; performing a second scanning process that is to scan the sensing area after the first scanning process is completed, to obtain a second number of pixel data; performing pixel binning on the second number of pixel data according to an offset value and an arithmetic value, wherein the offset value is determined according to the first number of pixel data.

A photoelectric conversion apparatus comprising: a pixel array; a signal line; a processing circuit; a switch for controlling conduction between the signal line and an input node of the processing circuit; and a control unit. The control unit performs a first transition in which, after resetting of the processing circuit, the switch is transitioned to an OFF state and then, during a period after the floating diffusion is reset during which the pixel signals are read out of the pixels into the signal line, the switch is transitioned at least from the OFF state to an ON state; keeps the switch in the OFF state during a period during which the transfer transistor is performing the transfer; and performs a second transition in which, after the transfer, the switch is transitioned from the OFF state to the ON state.

An image sensor includes: a plurality of pixels having photoelectric conversion units that convert incident light to charges, and readout units; a first signal line, connected to the plurality of pixels, that outputs a first signal transferred to the readout unit based upon the charge converted by the photoelectric conversion unit; and a second signal line, connected to the plurality of pixels, that outputs a second signal after the readout unit has been reset.

An imaging device includes a pixel, and a signal processor configured to randomly apply a first set of signals including a first driving signal applied to a first light source, and a first set of control signals applied to the pixel that adhere to a quasi-Gray code scheme to generate first through eighth correlation signals based on light output from the first light source according to the first driving signal and reflected from an object. The signal processor is configured to randomly apply a second set of signals including a second driving signal applied to the first light source, and a second set of control signals applied to the pixel that adhere to the quasi-Gray code scheme to generate ninth through sixteenth correlation signals based on light output from the first light source according to the second driving signal and reflected from the object.

An imaging device includes a pixel, and a signal processor configured to randomly apply a first set of signals including a first driving signal applied to a first light source, and a first set of control signals applied to the pixel that adhere to a quasi-Gray code scheme to generate first through eighth correlation signals based on light output from the first light source according to the first driving signal and reflected from an object. The signal processor is configured to randomly apply a second set of signals including a second driving signal applied to the first light source, and a second set of control signals applied to the pixel that adhere to the quasi-Gray code scheme to generate ninth through sixteenth correlation signals based on light output from the first light source according to the second driving signal and reflected from the object.

An electronic device includes a first substrate and a second substrate, a first metal plate, and a second metal plate. On each of the first substrate and the second substrate, an electronic component is mounted. The first substrate and the second substrate are positioned toward a stacking direction with respective main surfaces facing each other. The first metal plate includes a flat portion that is interposed between the first substrate and the second substrate and that directly or indirectly abuts the electronic component mounted on the first substrate and the electronic component mounted on the second substrate, and a first shield portion that covers a portion of the side surface of the first substrate. The second metal plate includes a second shield portion that covers the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate. The first metal plate and the second metal plate abut each other directly or indirectly.

A solid-state imaging device according to an embodiment includes a first charge detector, a first output circuit and a pulse generator. The first charge detector includes a plurality of first pixels and is configured to detect charges accumulated in the plurality of first pixels. The first output circuit is configured to amplify the charges detected by the first charge detector and output the charges as an output signal. The pulse generator is configured to generate a sampling pulse to extract a charge signal from the output signal during a period different from a signal output period in which the output signal is outputted.

An image sensing device includes a first substrate structured to support a pixel array that includes a plurality of unit pixels arranged in a first direction and a second direction and configured to detect incident light to produce pixel signals carrying image information in the incident light; a second substrate structured to support one or more circuits for operation of the image sensing device including receiving a pixel signal from the plurality of unit pixels; and a shielding layer disposed between the first substrate and the second substrate, wherein the shielding layer includes shielding driver circuitry and conductive lines coupled to the shielding driver circuitry to receive electrical currents which produce electromagnetic fields to offset electromagnetic fields induced by currents in the one or more circuits supported by the second substrate.

An image sensing device includes a first substrate structured to support a pixel array that includes a plurality of unit pixels arranged in a first direction and a second direction and configured to detect incident light to produce pixel signals carrying image information in the incident light; a second substrate structured to support one or more circuits for operation of the image sensing device including receiving a pixel signal from the plurality of unit pixels; and a shielding layer disposed between the first substrate and the second substrate, wherein the shielding layer includes shielding driver circuitry and conductive lines coupled to the shielding driver circuitry to receive electrical currents which produce electromagnetic fields to offset electromagnetic fields induced by currents in the one or more circuits supported by the second substrate.

A camera module includes a driving assembly configured to drive a lens module in a direction intersecting an optical axis. The driving assembly includes: a driving magnet member; auxiliary magnet members arranged on opposing sides of the driving magnet member and arranged to have polarities different from a polarity of the driving magnet member in a first direction; and a driving coil including portions extending along boundaries between the driving magnet member and the auxiliary magnet members.