The present technology relates to an imaging device and an electronic device that enable highly accurate adjustment of a focus position and a camera shake correction position. The device includes: a lens that focuses subject light; an imaging element that photoelectrically converts the subject light from the lens; a circuit substrate including a circuit that externally outputs a signal from the imaging element; an actuator that drives the lens with a Pulse Width Modulation (PWM) waveform in at least one of an X-axis direction, a Y-axis direction, or a Z-axis direction; and a detection unit that detects a magnetic field generated by a coil included in the actuator. The actuator drives the lens to move a focus, or drives the lens to reduce an influence of camera shake. The present technology can be applied to the imaging device.

An image sensor is disclosed. The image sensor includes a substrate including an active region and a dummy region, a plurality of unit pixels on the active region, a transparent conductive layer on a first surface of the substrate, a light-blocking layer on the transparent conductive layer and electrically connected to the transparent conductive layer, the light-blocking layer having a grid structure adjacent light transmission regions, and a pad electrically connected to the light-blocking layer, on the dummy region.

An image sensor includes an active pixel array, at least one dummy reset array, a dummy read array, and an image processor. The image processor sequentially resets respective rows of pixels included in the at least one dummy reset array in a period in which pixels of the active pixel array do not perform a reset operation, and sequentially reads respective rows of pixels included in the dummy read array in a period in which the pixels of the active pixel array do not perform a read operation.

An image sensor includes image sensor cells generating an image signal in response to one or more control signals, and a first driver generating a first control signal. The first driver includes a first positive supply terminal connected to a first power supply node. The image sensor also includes a voltage generator generating a first voltage at the first power supply node, where the voltage generator includes charge pump cells to receive clock signals and to source charge to the first power supply node, a delay line including delay line elements generating clock signals, where a first charge pump cell receives a first clock signal generated by a first delay line element, where a second charge pump cell receives a second clock signal generated by a second delay line element, and where a delay between the first clock signal and the second clock signal is determined by the delay line.

A photoelectric conversion element includes a first pixel array including first light-receiving sections arranged in a direction and a second pixel array including second light-receiving sections arranged in the direction. Each of the first light-receiving sections includes a first pixel configured to receive at least light having a first wavelength inside a visible spectrum and a first pixel circuit configured to transmit a signal from the first pixel to a subsequent stage. Each of the second light-receiving sections includes a second pixel configured to receive at least light having a second wavelength outside the visible spectrum and a second pixel circuit configured to transmit a signal from the second pixel to the subsequent stage. The second pixel circuit is provided in a vicinity of the second pixel.

[Object] To provide a vehicle-mounted camera capable of successfully absorbing stress applied to a flexible board that connects a main board and an imaging device board to each other.

[Solving Means] The vehicle-mounted camera includes an imaging device board, a main board, and a flexible board. The imaging device board includes a first terminal. The main board includes a second terminal. The flexible board includes a first connection portion to be connected to the first terminal, a second connection portion to be connected to the second terminal, and a first bending portion and a second bending portion that are located between the first connection portion and the second connection portion and are bent along a first bending axis and a second bending axis intersecting with each other in a developed state of the flexible board. The vehicle-mounted camera is capable of absorbing stress in any direction applied to the flexible board.

An image sensor includes: a plurality of pixels having photoelectric conversion units that convert incident light to charges, and readout units; a first signal line, connected to the plurality of pixels, that outputs a first signal transferred to the readout unit based upon the charge converted by the photoelectric conversion unit; and a second signal line, connected to the plurality of pixels, that outputs a second signal after the readout unit has been reset.

A pixel binning method for processing pixel data acquired from an image sensor comprising a pixel array, the pixel binning method includes performing a first scanning process that is to scan a sensing area of the image sensor, to obtain a first number of pixel data; performing a second scanning process that is to scan the sensing area after the first scanning process is completed, to obtain a second number of pixel data; performing pixel binning on the second number of pixel data according to an offset value and an arithmetic value, wherein the offset value is determined according to the first number of pixel data.

An image capturing device unit capable of reducing noise generated in image signals due to power supply. A pixel portion of an image capturing device has pixels arranged in a matrix in first and second directions perpendicular to each other. Output lines are arranged in parallel to the second direction, for reading out pixel signals in the second direction for each of groups of pixels arranged in the first direction. A power supply wiring is arranged on a substrate surface different from a surface on which the image capturing device is mounted and supplies power to the device, and includes a draw-out wiring portion arranged to be routed along the second direction in a pixel portion area which overlaps the pixel portion when the device is projected onto the substrate in a third direction perpendicular to the first and the second directions.

An image sensor includes pixel regions separated by an isolation region and receiving incident light, color filters respectively disposed on a surface of the semiconductor substrate corresponding to the pixel regions, a cover insulating layer disposed on the surface of the semiconductor substrate and covering the color filters, first transparent electrodes disposed on the cover insulating layer and spaced apart to respectively overlap the color filters, an isolation pattern disposed on the cover insulating layer between the first transparent electrodes and having a trench spaced apart from the first transparent electrodes, a drain electrode disposed in the trench of the isolation pattern, and an organic photoelectric layer and a second transparent electrode sequentially disposed on the first transparent electrodes and the isolation pattern.