Patent classifications
H05B6/80
Portable Food Preparation Assembly
A portable food preparation assembly for storing and subsequently cooking food items includes a lunchbox that has a first compartment and a second compartment. The first compartment is defined by a thermally insulating material to store food items and ice for cooling the food items. A microwave oven is integrated into the lunchbox for directing microwave energy into the second compartment to cook food items positioned in the second compartment.
REFRIGERATION DEVICE AND OPERATING METHOD THEREFOR
The present disclosure provides a refrigeration device including a circuit having an evaporator, a compressor, a condenser, and an expansion valve orderly connected by a refrigerant flow path. The refrigeration device further includes a first sensor to sense ambient temperature, second sensor to sense evaporator inlet temperature, a microwave module disposed proximal to the evaporator to generate microwaves, and a controller coupled to the first sensor, the second sensor and the microwave module. The controller determines whether a difference in temperature value between the ambient temperature and the evaporator inlet temperature is equal to or greater than a first predetermined temperature value, and initiates operation of the microwave module to heat an inlet of the evaporator when the difference in temperature value between the ambient temperature and the evaporator inlet temperature is equal to or greater than the first predetermined temperature value.
Coaxial microwave rotary applicator for material processing
Disclosures of the present invention describe a coaxial microwave rotary applicator for material processing, mainly comprising: a waveguide unit, a microwave generator connected to one end of the waveguide unit, a bearing unit, a chamber, a rotary shaft, a driver unit, a sampling unit. The bearing unit is connected to the waveguide unit through a non-rotary ring, and the chamber is connected to a rotary ring of the bearing unit, and the microwave generator is configured for supplying a microwave to the chamber. By such arrangements, it is able to uniformly heat a specific material disposed in the chamber by driving the chamber to rotate. It is worth noting that, a user is allowed to clearly observe the processing progress via the sampling unit during the heating process of the specific material.
Coaxial microwave rotary applicator for material processing
Disclosures of the present invention describe a coaxial microwave rotary applicator for material processing, mainly comprising: a waveguide unit, a microwave generator connected to one end of the waveguide unit, a bearing unit, a chamber, a rotary shaft, a driver unit, a sampling unit. The bearing unit is connected to the waveguide unit through a non-rotary ring, and the chamber is connected to a rotary ring of the bearing unit, and the microwave generator is configured for supplying a microwave to the chamber. By such arrangements, it is able to uniformly heat a specific material disposed in the chamber by driving the chamber to rotate. It is worth noting that, a user is allowed to clearly observe the processing progress via the sampling unit during the heating process of the specific material.
Monolithic modular microwave source with integrated temperature control
Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
SYSTEM FOR CURING AND/OR INSPECTING A PIPELINE LINING AND METHOD FOR CURING AND/OR INSPECTING A PIPELINE LINING
The invention relates to a system (10) for curing and/or inspecting a pipeline lining (30) positioned in a pipeline (20), the pipeline lining (30) comprising an outer plastics material layer and an inner fiber composite layer, the fiber composite layer comprising a plastics material which is to be cured and/or which is at least partially cured. In accordance with the invention, the system (10) comprises at least one high-frequency unit (40) which comprises at least one microwave-generator unit (41) and at least one microwave-transmitting antenna (42) for curing a plastics material which is to be cured, at least the at least one microwave-transmitting antenna (42) being movable in the pipeline (20) by means of a transporting device (60).
RF circuit and enclosure having a micromachined interior using semiconductor fabrication
An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.
RF circuit and enclosure having a micromachined interior using semiconductor fabrication
An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.
Tube Module and Tube Assembly Including Same
A tube module has a tube having a bore and made of a ceramic material; a heat insulator surrounding an outer circumferential surface of the tube and made of a ceramic material; and a flange provided along an edge of each of both surfaces of the heat insulator and formed in a band shape.
Tube Module and Tube Assembly Including Same
A tube module has a tube having a bore and made of a ceramic material; a heat insulator surrounding an outer circumferential surface of the tube and made of a ceramic material; and a flange provided along an edge of each of both surfaces of the heat insulator and formed in a band shape.