A display device includes: a first substrate including a display area including display elements arranged in a matrix; a second substrate including a transparent material; and a seal portion placed so as to surround a periphery of the display area, wherein the seal portion includes a core including a light shielding material and a covering member including a sealing material, and the first substrate and the second substrate are sealed while a surface of the covering member in the seal portion serves as a contact surface.

The present invention overcomes image defects such as the brightness inclination or smears by reducing the line resistance of a power source bus line which supplies electricity to organic EL elements. A plurality of pixels which are arranged in a matrix array is connected to power source lines, and the plurality of power source lines are connected to a power source bus line. Both ends of the power source bus line are connected to a power source part via a FPC. By supplying electricity to both ends of the power source bus line from the power source part, the line resistance of the power source bus line can be reduced.

The present invention overcomes image defects such as the brightness inclination or smears by reducing the line resistance of a power source bus line which supplies electricity to organic EL elements. A plurality of pixels which are arranged in a matrix array is connected to power source lines, and the plurality of power source lines are connected to a power source bus line. Both ends of the power source bus line are connected to a power source part via a FPC. By supplying electricity to both ends of the power source bus line from the power source part, the line resistance of the power source bus line can be reduced.

A first metal layer provided on a resin substrate layer, a flattening film provided on the first metal layer, a second metal layer and a plurality of organic EL elements provided on the flattening film, and a sealing film covering the plurality of organic EL elements are provided. An organic layer provided in the sealing film includes a circumferential end edge positioned in a frame region. A slit overlapping the circumferential end edge of the organic layer is formed in an outer side of the flattening film. The first metal layer and the second metal layer are in contact with each other inside the slit. An opening is formed in a metal layer of the first metal layer and the second metal layer, the opening exposing an interlayer insulating film from the metal layer of the first metal layer and the second metal layer at a position at which the organic layer and the slit overlap each other.

A transparent desiccant for organic EL and methods for using the transparent desiccant are described, which is a cured product of an organopolysiloxane composition that contains (A) an alkenyl-group-containing organopolysiloxane including a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) chemical formula (I):
H.sub.aR.sub.bSiO.sub.(4-a-b)/2  (I)
(where R is a C1-10 monovalent hydrocarbon group, a is 0.001-1.0, and b is 0.7-2.1), and (C) a hydrosilylation catalyst. The number of mol Y of silicon-atom-bonded hydrogen atoms (mol) in component (B) satisfies the formula 0.002 (mol)≤(Y-X)≤0.8 (mol) relative to the number of mol X of silicon-atom-bonded alkenyl groups (mol) in component (A). The transparent desiccant for an organic EL is highly transparent, capable of top emission, has low shrinkage growth, suppresses loss of an element light-emitting portion, suppresses the short-circuit phenomenon, and has exceptional defoaming properties in the material curing process.

A sealing structure (200) seals a light emitting unit (140) and includes a first inorganic film (210), a second inorganic film (220), a first resin-containing film (230), and a second resin-containing film (240). The film thickness of the first inorganic film (210) is equal to or greater than 1 nm and equal to or less than 300 nm. The first resin-containing film (230) is in contact with the first inorganic film (210) and includes a first resin. The second inorganic film (220) is positioned on an opposite side of the first inorganic film (210) with the first resin-containing film (230) interposed between the first and second inorganic films. The second resin-containing film (240) is positioned between the first resin-containing film (230) and the second inorganic film (220) and is in contact with the second inorganic film (220). The second resin-containing film (240) includes a second resin.

A sealing structure (200) seals a light emitting unit (140) and includes a first inorganic film (210), a second inorganic film (220), a first resin-containing film (230), and a second resin-containing film (240). The film thickness of the first inorganic film (210) is equal to or greater than 1 nm and equal to or less than 300 nm. The first resin-containing film (230) is in contact with the first inorganic film (210) and includes a first resin. The second inorganic film (220) is positioned on an opposite side of the first inorganic film (210) with the first resin-containing film (230) interposed between the first and second inorganic films. The second resin-containing film (240) is positioned between the first resin-containing film (230) and the second inorganic film (220) and is in contact with the second inorganic film (220). The second resin-containing film (240) includes a second resin.

A light emitting material containing an adjustment compound N in addition to a donor compound D and an acceptor compound A that form an exciplex and satisfying HOMO(D)>HOMO(N)>HOMO(A), LUMO(D)>LUMO(N)+0.1 eV and LUMO(N)>LUMO(A) has improved luminous efficiency or emission lifetime.

A display device according to an embodiment of the present invention includes: a substrate, a plurality of pixels on the substrate, a first inorganic insulating layer that covers the plurality of pixels, a conductive layer on the first inorganic insulating layer, and a second inorganic insulating layer that on the conductive layer, the conductive layer being between the first inorganic insulating layer and the second inorganic insulating layer, wherein the first inorganic insulating layer includes an area that is in direct contact with the second inorganic insulating layer, and all of the conductive layer is covered with the first inorganic insulating layer and the second inorganic insulating layer.

A method of manufacturing a display device includes: the first substrate preparation step of preparing a first substrate including insular, first electrodes, one for each of the plurality of subpixels; the second substrate preparation step of preparing a second substrate including a second electrode; the subpixel-specific layer forming step of forming insular subpixel-specific layers, one for each of the first electrodes, on either one or both of a top face of the first substrate and a top face of the second substrate; the nanoparticle layer forming step of forming a nanoparticle layer including a stack of nanoparticles on either one or both of the topmost face of the first substrate and the topmost face of the second electrode; and the bonding step of bonding the first substrate and the second substrate together via the nanoparticle layer in such a manner that the first electrodes face the second electrode.