An electric cooking appliance includes a glass-ceramic substrate having a top surface for supporting cookware for heating thereon, and a bottom surface opposite the top surface. The electric cooking appliance includes a plurality of thermoresistive heating elements disposed and spaced apart on the bottom surface of the glass-ceramic substrate, with each of the plurality of thermoresistive heating elements including graphene nanoparticles embedded in a ceramic matrix for generating heat upon application of electric current to the respective thermoresistive heating element. Each thermoresistive heating element is electrically connected to a power supply such that one or more of the plurality of thermoresistive heating elements are selectively activated to receive electric current to heat localized areas of the glass-ceramic substrate.

A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes. Assuming that the number of the conductive linear bodies is N, a resistance value of a n-th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is r.sub.n, and a resistance value of the electrodes is R, all of conditions represented by numerical formulae (F1), (F2), and (F3) below are satisfied. (F1): r.sub.1/R≤300 (F2): r.sub.n+1≤r.sub.n (In the formula (F2), n is an integer of 1 or more) (F3): 0<r.sub.1-r.sub.N

A wiper system includes a wiper blade to wipe a windshield, an angle sensor, and a motor. The motor drives the wiper blade to reverse a wipe operation of the wiper blade at a reversal position based on the angle sensor, such that rotation of the motor when the wiper blade moves to a released position is reversed to rotation of the motor when the wiper blade moves to a standby position. A first heating element is installed near a front pillar and generates heat when energized. A determiner determines whether snow accumulates on a surface of the windshield based on an operation of the wiper system. A controller controls energization of the first heating element and energizes the first heating element on determination of the determiner that snow accumulates on the surface of the windshield.

A laminated side glazing of a vehicle, with an upper edge, a lower edge, a front edge, and a rear edge, includes an outer pane and an inner pane, which panes are bonded to one another via a thermoplastic intermediate layer, and a transparent, heatable coating, which is arranged between the outer pane and the inner pane and which is electrically contacted by a first collecting busbar and a second collecting busbar and which has, for guiding a heating current flowing between the collecting busbars, at least one decoated isolating line that runs between the collecting busbars, wherein the first collecting busbar and the second collecting busbar are arranged along the front edge or the rear edge and wherein an upper part and a lower part are defined by pattern of decoated isolated lines different in the upper part and the lower part of the laminated side glazing.

A heater system is provided, which includes a plurality of heaters, a controller for supplying power to the plurality of heaters, a plurality sets of auxiliary wires extending from the plurality of heaters, and a wire harness for connecting the plurality sets of auxiliary wires to the controller. Each set of auxiliary wires includes three wires, two of the three wires being made of different materials and being joined to form a thermocouple junction, such that each of the plurality of heaters is operable to function as both a heater and a temperature sensor.

A MEMS hotplate is used as a test substrate for characterizing a temperature-dependent fabrication process. According to a variant, an array of MEMS hotplates is used to provide multiple test substrates which can be simultaneously heated to different temperatures to provide multiple different temperature-dependent characterizations of the process.

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

According to one embodiment, a heater includes an insulating substrate, a heat generating section formed in the insulating substrate and including a plurality of divided regions in a longitudinal direction, temperature sensors detecting temperature of the heat generating section and a wiring pattern for power feed to the temperature sensors, each formed in a layer different from a layer in which the heat generating section is formed in the insulating substrate. The heat generating section, the temperature sensors, and the wiring pattern are layer stacked.

An electric heater includes a substrate, an outer pattern part disposed on one surface of the substrate, an inner pattern part disposed on the one surface of the substrate so as to be located such that the outer pattern part surrounds the inner pattern part, and to be spaced apart from the outer pattern part. A pair of first electrodes is connected to the outer pattern part and a pair of second electrodes is connected to the inner pattern part and spaced apart from the pair of first electrodes, and the pair of second electrodes are located inside the outer pattern part.

A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.