A cooking device that includes one or more resistive coatings disposed on a surface of a cooking container. In one embodiment, the resistive coatings are coated to an outside layer of an internal cooking container, which is surrounded peripherally by an external cooking container. The resistive coating converts electricity to heat, thereby heating the internal cooking container. There may be multiple resistive coatings, and a controller is configurable to independently adjust the electric current transiting each of the resistive coatings.

A layered heater includes a resistive layer formed from a conductive material and separated into an intermediate area and a resistive circuit pattern by a plurality of cuts that extend all the way through the resistive layer. The resistive circuit pattern includes termination pads electrically connected to the resistive circuit pattern with the intermediate area being electrically inactive. A conductive overlay is disposed over a continuous portion of the resistive circuit pattern. The plurality of cuts extend longitudinally into the conductive overlay such that no portion of the resistive pattern is present outside the conductive overlay.

A layered heater includes a resistive layer defining a resistive circuit pattern having at least one bend portion. A conductive overlay is provided on at least one of a top surface and a bottom surface of the bend portion to alleviate the current crowding effect, thereby protecting the electric circuit from premature failure. Methods of manufacturing the layered heater are also disclosed. The overlay may be formed on the bend portion after the resistive layer is formed. The overlay may also be formed on a substrate or a dielectric layer that supports the resistive layer before the resistive layer is formed.

One example of a heating element includes a first carbon nanotube (CNT) layer and a second CNT layer. At least a portion of the first CNT layer overlaps at least a portion of the second CNT layer, and the first CNT layer includes a first perforated region having a plurality of perforations. Another heating element includes a CNT sheet with a first perforated region having a plurality of perforations and a first perforation density and a second perforated region having a plurality of perforations and a second perforation density different from the first perforation density. A method of forming a heating element includes perforating a first CNT layer so that it includes a perforated region and stacking the first CNT layer with a second CNT layer such that at least a portion of the first CNT layer overlaps at least a portion of the second CNT layer.

An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.

The present invention relates to a heating element and a manufacturing method therefor. More specifically, according to one embodiment of the present invention, provided is a method for manufacturing a heating element, comprising the steps of: preparing an adhesive film; forming conductive heating patterns on the adhesive film; and laminating a transparent substrate on at least one surface of the adhesive film having the conductive heating patterns.

The present disclosure relates to aerosol delivery devices. The aerosol delivery devices may include a reservoir containing a liquid aerosol precursor composition and an atomizer including an electrical resistance heating element and a nonfibrous liquid transport element having a microtextured surface adapted for surface wicking of the liquid aerosol precursor composition across the microtextured surface, the microtextured surface of the liquid transport element being in fluid communication with the reservoir and in fluid communication with the electric resistance heating element.

A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.

The present invention provides a thick film element having a covering layer with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating materials, and the mode of heating is electrical heating. The covering layer, the thick film coating and the carrier are selected from a material that fulfills every of the following equations:

[00001]${}_1.Math.A.Math.\frac{T_1-T_0}{d_1}=a{}_3.Math.A.Math.\frac{T_3-T_0}{d_3},.Math.{}_2.Math.A.Math.\frac{T_2-T_0}{d_2}=b{}_1.Math.A.Math.\frac{T_1-T_0}{d_1},.Math.{}_2.Math.A.Math.\frac{T_2-T_0}{d_2}=c{}_3.Math.A.Math.\frac{T_3-T_0}{d_3};$

wherein 200a10.sup.4, 0<b1000, 0<c510.sup.5. The covering layer of the thick film element of the present invention has high heat conductivity, and is suitable for coating products with a single-sided heating covering layer. The present invention improves heat transfer efficiency and reduces heat loss when double-sided heating is not required.

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.