A method of providing spark ignition for an engine or other equipment having a combustion chamber. A radio frequency wave or a microwave (RF/microwave) generator delivers radio frequency waves or microwaves to a transmit antenna inside the combustion chamber. At least one RF/microwave receive antenna is attached to an internal surface of the combustion chamber and comprises two or more RF/microwave focusing features with a spark gap between them. The transmit antenna wirelessly energizes the receive antenna, which generates a spark between the two focusing features.

One plasma processing apparatus according to the invention includes: a processing chamber in which a sample is subjected to plasma processing; a first radio frequency power supply configured to supply a first radio frequency power for generating plasma via a matching unit; a sample stage on which the sample is placed; a second radio frequency power supply configured to supply a second radio frequency power to the sample stage; and a control device configured to control a matching unit so as to perform matching during a period corresponding to a mode in which a requirement for matching by the matching unit is defined when the first radio frequency power is modulated by a waveform having a plurality of amplitude values and repeating periodically. The period is each period of the waveform corresponding to any one of the plurality of amplitude values.

A method is provided for treating an implant in a medical care center prior to using the implant in a medical procedure. The method comprises applying a plasma-generating electromagnetic (EM) field using at least one electrode so as to generate plasma in a vicinity of the implant while displacing the electrode and the implant relative to one another. A portable plasma module and a docking station configured to connect to the portable plasma module, thereby forming a plasma generating system, are also provided. A plasma generating apparatus for treating an implant prior to using the implant in a medical procedure is also provided.

An apparatus for plasma processing that performs an etching on a workpiece, includes: a container; a gas supply system for supplying a processing gas into the container; a plasma source for exciting the processing gas; a support for holding the workpiece inside the container; an exhaust system for exhausting an internal space of the container; electrode plates provided on an inner wall of the container; insulators for electrically insulating the electrode plates from each other; a DC power supply for independently applying a DC voltage to each of the electrode plates; and a controller for controlling the gas supply system, the plasma source, and the DC power supply. The controller controls the gas supply system, the plasma source, and the DC power supply such that the DC voltage is supplied to each electrode plate during execution of the etching or after completion of the etching.

An apparatus for plasma processing that performs an etching on a workpiece, includes: a container; a gas supply system for supplying a processing gas into the container; a plasma source for exciting the processing gas; a support for holding the workpiece inside the container; an exhaust system for exhausting an internal space of the container; electrode plates provided on an inner wall of the container; insulators for electrically insulating the electrode plates from each other; a DC power supply for independently applying a DC voltage to each of the electrode plates; and a controller for controlling the gas supply system, the plasma source, and the DC power supply. The controller controls the gas supply system, the plasma source, and the DC power supply such that the DC voltage is supplied to each electrode plate during execution of the etching or after completion of the etching.

A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.

Provided is a manufacturing method of an interior member of a plasma processing apparatus, which improves processing yield. The interior member is disposed inside a processing chamber of the plasma processing apparatus and includes, on a surface thereof, a film of a material having resistance to plasma. The manufacturing method includes: a step of moving a gun by a predetermined distance along the surface of the interior member to spray the material to form the film, and disposing a test piece having a surface having a shape simulating a surface shape of the interior member within a range of the distance within which the gun is moved and forming the film of the material on the surface of the test piece; and a step of adjusting, based on a result of detecting a crystal size of the film on the surface of the test piece and presence or absence of a residual stress or inclusion of a contaminant element, a condition of forming the film on the surface of the interior member by the gun.

An RF generating device 2, which attenuates harmonics in RF power amplified by an RF amplifier and supplied to plasma generating electrodes, includes an RF generation unit 201 that generates a composite wave by combining a fundamental wave with a compensation wave which is made by inverting a phase of a harmonic generated by inputting the fundamental wave.

A film formation method according to one aspect of the present disclosure includes: a first step of irradiating a substrate, on which a recess is formed, with an electron beam; a second step of supplying a raw material gas to the substrate and allowing the raw material gas to be adsorbed on a bottom surface of the recess; and a third step of supplying hydrogen radicals to the substrate and allowing the raw material gas adsorbed on the bottom surface of the recess to react with the hydrogen radicals.

A capacitive element using a liquid as a dielectric, whereby the capacitance is prevented from changing. The capacitive element is equipped with: a storage container that has an inlet port for introducing a liquid serving as a dielectric, has an outlet port for discharging the liquid, and is filled with the liquid; and at least one pair of electrodes that are provided in the storage container and face each other, wherein an opening section for exhausting air bubbles in the storage container is formed in an upper wall of the storage container.