Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).

Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.

Disclosed is a printed circuit board having at least one power semiconductor soldered thereon and, as a thermal fuse, a spring having two contact arms fastened to solder pads of the printed circuit board by soldered connections. The spring is under mechanical stress such that at least one of the two contact arms moves away from one of the solder pads by spring force as soon as the soldered connection loses its strength and fails due to overheating. The soldered connection of at least one of the contact arms loses its strength at a lower temperature and is formed from a different alloy than the soldered connection that connects the power semiconductor to the printed circuit board. A method for populating a printed circuit board is also described.

A field device (1) includes an electronic circuit (200) connected to at least one of a sensor (600) and an actuator, a bimetal temperature switch (400) connected to a power source (100) in series with the electronic circuit (200) and configured to turn on when rising to a first temperature, a heating element (500) connectable to the power source (100) in parallel with the electronic circuit (200) and the temperature switch (400), and a housing (300) configured to house the electronic circuit (200), the temperature switch (400), and the heating element (500).

The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

The first and second electronic components are mounted on a printed circuit board. A temperature indicating resin comes in contact with not the second electronic component but the first electronic component. The temperature indicating resin visually changes upon increase in the temperature. Alternatively, an electronic component is mounted on the printed circuit board. The temperature indicating resin comes in contact with not the electronic component but the printed circuit board. The temperature indicating resin visually changes upon increase in the temperature.

An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.

The present invention refers to an electronic control (1) of a compressor (2), the electronic control (1) disposed in an encasement 5 (3), wherein the electronic control (1) comprises: a main board (4) associated to at least an auxiliary board (5,6,7), wherein one of the auxiliary boards (5,6,7) is a heat-generating board (7), wherein the heat-generating board (7) is disposed at a first distance (D.sub.1) in relation to a first wall of the encasement (P.sub.1), wherein the other auxiliary boards 0 (5,6) are disposed at least at a second distance (D.sub.2, D.sub.3) in relation to the first wall of the encasement (P.sub.1), wherein the first distance (D.sub.1) is less than the second distance (D.sub.2). A compressor (2) and a cooling equipment are also described.