An insulating metal substrate structure is provided. The insulating metal substrate structure includes an electrically-insulating layer, a plurality of metal layers, a plurality of electrically-insulating heat-conductive layers, and a heat-dissipation layer. The plurality of electrically-insulating heat-conductive layers are formed on the heat-dissipation layer. The electrically-insulating layer surrounds the plurality of metal layers, such that the plurality of metal layers are separated into different regions in a different region to form a predetermined circuit pattern. The electrically-insulating layer has at least one recessed corner structure that is configured to position the electrically-insulating heat-conductive layers filled between one of the metal layers and the heat-dissipation layer.

In a sensor arrangement for measurement of the temperature of a disk, it is provided that the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out from the housing, the heat-conducting element is configured as a rigid pin, the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, the rigid pin is provided and configured to make a thermal contact with the disk.

A shielding housing structure of an electric connector includes an insulating body including a first terminal slot for insertion of a first terminal set, a second terminal slot for insertion of a second terminal set, a socket for insertion of a preset board; a shielding housing having an accommodation space assembled with a top side of the insulating body, and top holes and lateral holes formed thereon, and an insertion hole formed on upper edges of lateral hole; and a movable cover having a top covering plate having top openings, and a side covering plate having lateral openings. The top covering plate is plugged into the insertion hole, and can be slid to a first position to form thermal convection ventilation holes on the shielding housing structure, or the top covering plate can be slid to a second position to form an enclosing status of the shielding housing.

A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.

A scanner for scanning a dental site comprises a base, a detector mounted to the base, and an optical element to redirect light reflected off of the dental site towards the detector along a detection axis in a first direction. Two or more flexures couple the optical element to the base, wherein thermal expansion or contraction of the optical element with respect to at least one of the detector or the base bends each flexure of the two or more flexures in a respective second direction without bending the flexure in a respective third direction approximately perpendicular to the first direction and the respective second direction, wherein the two or more flexures maintain an alignment of the optical element to the detector with changes in temperature.

A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.

An electric range that may include a case, a cover plate coupled to an upper end of the case and having an upper surface on which a heating target is disposed, at least one heater disposed under the cover plate and configured to heat the heating target, an upper bracket that is disposed under the at least one heater and supports the at least one heater, a base bracket that is disposed under the upper bracket and on which a printed circuit board is installed, a heat sink installed on the printed circuit board, a blower fan installed on the base bracket and configured to discharge air toward the heat sink, and an air guide that communicates with the blower fan and surrounds the heat sink to form a flow path of air which cools the heat sink.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A system includes a first printed circuit board (PCB), a temperature sensor, a switching circuit provided on the first PCB, and a controller. The temperature sensor is configured to measure temperature of at least an area of the first PCB. The controller is configured to trigger the switching circuit to turn off power to the first PCB, based at least in part on the temperature sensor detecting a temperature above a temperature threshold. The system is able to disrupt power much faster than conventional methods of power protection which may have a blind spot to certain areas of the first PCB, since these methods rely on power disruption when a maximum power is sensed.