An optical transceiver includes a circuit board having a first side and a first edge; a thermal conductive member configured to be attached on the first side of the circuit board; the thermal conductive member having a first thermal conductive face inclined with respect to the first side of the circuit board and parallel to the first direction; a filling material having a thermal conductivity; and a housing having an inner face and an inner space, the housing being configured to house the circuit board, the circuit component, the thermal conductive member, and the filling material, and configured to hold the electrical connector at an end thereof in the first direction, the housing having a second thermal conductive face facing the first thermal conductive face with a spacing. The filling material adheres to the first thermal conductive face and the second thermal conductive face.

A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

A heat dissipation structure of the door leaf of an LED display box, comprising a box frame (100) and a box door leaf (200), a heat collection cavity (300) is simultaneously formed in the box frame (100) and on the backs of the LED display modules, when working, a number of the LED display modules are energized and emitting light, and the light is irradiated forward, and the heat generated by the operation of the LED display modules is concentrated in the heat collection cavity (300), the box door leaf (200) comprises an outer door leaf plate (210) and an inner lining board (220), wherein the inner lining board (220) is arranged on the inner side (211) of the outer door leaf plate (210), and at the same time, a ventilation and heat dissipation channel (400) is formed between the inner lining board (220) and the outer door leaf plate (210), the ventilation and heat dissipation channel (400) is in communication with the heat collection cavity (300), the ventilation and heat dissipation channel (400) comprises an air inlet (410) and an air outlet (420), wherein the air inlet (410) is in communication with the heat collection cavity (300), and the air outlet (420) is arranged on the outer door leaf plate (210), the box heat source part (500) is fixedly connected to the inner side (221) of the lining board, and at the same time, the box heat source part (500) is located in the heat collection cavity (300).

A display device of the present disclosure includes: a display panel; a module cover disposed behind the display panel; a PCB coupled to the module cover and on which a plurality of elements are positioned; and a vapor chamber coupled to the PCB, and that contacts a contact element which is at least any one of the plurality of elements, wherein the vapor chamber includes: a first plate including a heat absorbing part that contacts the contact element; a second plate coupled to the first plate; and a fluid flowing through a space provided between the first plate and the second plate, wherein the first plate extends upward from the heat absorbing part while bypassing a protruding element so as not to overlap with the protruding element in a front-rear direction, the protruding element overlapping with the first plate in an up-down direction among the plurality of elements.

A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

The present invention relates to an embedded printed circuit board including: an insulation substrate including a cavity; a sensor device disposed on the cavity; an insulating layer disposed on the insulation substrate, having an opening part exposing the sensor device; and a pad part disposed on the lower surface of the opening part exposing the sensor device.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a plurality of heater traces in a substrate. The RGA interposer also includes a plurality of vias in the substrate. The vias extend vertically from the bottom surface to the top surface of the substrate. The RGA interposer may have one of the vias between two of the heater traces, wherein the vias have a z-height that is greater than a z-height of the heater traces. The heater traces may be embedded in a layer of the substrate, where the layer of the substrate is between top ends and bottom ends of the vias. Each of the plurality of heater traces may include a via filament interconnect coupled to a power source and a ground source. The heater traces may be resistive heaters.