A thermal monitoring system (101) for sensing a temperature of a monitored device (104) includes a carrier (102) having a first surface (112) and a biasing element (122) coupled to the carrier (102) and configured to extend between the carrier (102) and the monitored device (104) to provide a first thermal conduction path therebetween. The biasing element (122) includes a first end (128) contacting the first surface (112) and a second end (130) opposite the first end (128) and configured to contact the monitored device (104). The biasing element (122) further includes a main body (132) formed of a thermally conductive material extending continuously between the first end (128) and the second end (130). The main body (132) is compressible between the monitored device (104) and the carrier (102). The thermal monitoring system (101) further includes a temperature sensor (124) coupled to the carrier (102) and configured to detect a temperature of the monitored device (104).

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.

An information handling system includes a printed circuit board (PCB) and an integrated circuit device. The integrated circuit device includes a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate. The substrate includes a ball grid array (BGA) on the first surface of the substrate. The integrated circuit device is bonded to a first surface of the PCB via the BGA. The die is collocated with the cutout area.

A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

An electrical feedthrough (1) is provided for improving the thermal properties and the electromagnetic compatibility (EMC) and also for simplified production of a medical instrument (7), in which electrical feedthrough individual contact pins (4), which are guided through a glass body (2) in a housing (20) of the instrument (7), are electrically connected to one another by a pluggable plug element (5), preferably in the form of a sheet metal part. Here, the plug element (5) firstly provides high thermal and electrical conductivity and secondly provides a shielding area that effectively prevents the input coupling of electromagnetic radiation. Preferably, the plug element (5) is formed in such a way that it independently develops a holding force for securing itself to the contact pins (4).

A display device includes: a circuit substrate including a plurality of pixel circuit units and a plurality of pads on a first surface thereof, the plurality of pads being electrically connected to the pixel circuit units; a display substrate on the circuit substrate and including a plurality of light emitting elements electrically connected to the pixel circuit units; a circuit board on the circuit substrate and including a plurality of circuit board pads electrically connected to the pads; a heat dissipation substrate on a second surface of the circuit substrate, the second surface being opposite to the first surface; and a cover substrate on the heat dissipation substrate and partially overlapping the circuit substrate and the circuit board. Each of the plurality of pads is in direct contact with at least one of the plurality of circuit board pads.

An electronic device includes a base, a circuit board and a heat dissipating module. The base includes a bottom cover and a frame. The frame is disposed on the bottom cover. An accommodating space is between the bottom cover and the frame. The bottom cover has an air inlet. The circuit board is disposed in the accommodating space. The circuit board has a through hole. The through hole corresponds to the air inlet. The heat dissipating module is disposed in the accommodating space and located above the circuit board. The heat dissipating module includes a fan. The fan corresponds to the through hole. The fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.

An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.

A display device is disclosed. The display device includes a display panel configured to display an image, and a printed circuit board electrically connected to the display panel and disposed at a back surface of the display panel. The printed circuit board includes an insulating layer, a first metal layer disposed at one surface of the insulating layer, pads including a first pad disposed on the first metal layer while being disposed inside a mounting area where an integrated circuit is mounted, and second pads disposed around the first pad, and a groove provided to extend from an inside of the mounting area to an outside of the mounting area.