In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can comprise at least one of 20 to 45 volume percent of the fluoropolymer, 15 to 35 volume percent of the plurality of boron nitride particles, 1 to 32 volume percent of the plurality of titanium dioxide particles, 10 to 35 volume percent of the plurality of silica particles, and 5 to 15 volume percent of the reinforcing layer; wherein the volume percent values are based on a total volume of the dielectric layer.

The present disclosure is related to a display device and a circuit board (200). The display device comprises a light-emitting module (100), a circuit board (200) and a conductive structure (300). The surface of the light-emitting module (100) is provided with a conductive portion (101). The circuit board (200) is arranged on a back face (102) of the light-emitting module (100), and has a first surface (201) close to the light-emitting module (100). The first surface (201) of the circuit board (200) is provided with an exposed external conductive layer (210), and the external conductive layer (210) is electrically connected to a ground wire of the circuit board (200). The conductive structure (300) is located between the circuit board (200) and the light-emitting module (100), and makes the external conductive layer (210) electrically connect to the conductive portion (101).

A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.

A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a thermally-conductive stiffener, at least one wiring layer over the stiffener, and a cover film over the at least one wiring layer, where the centroid of the stiffener is offset from the centerline of the cover film. Thus, utilizing the heat-sink characteristics of the stiffener, temperature differences among the upper and lower electrical pads of the FPC resulting from a heat-based interconnection procedure can be reduced and the temperatures across the FPC finger made more uniform, damage to the FPC prevented, and soldering yields improved.

A multi-layer ceramic wiring board is patterned with arrays of footprints for high-temperature surface mounted device active and passive components on one side of the board that is patterned with arrays of standard SMD footprints to enable placement and attachment of components including primary 2-terminal components and active components where the SMD pads are connected through vias and buried-layer interconnect traces to a multiple connection point arrays on the front and back side of the ceramic wiring board. Each pad is connected to multiple instances of the pad grid to connections to be made with a single post-fired print.

In a multilayer printed circuit board (circuit board 20) having an inverter (switching elements 22) mounted thereto, only a second wiring pattern P2 arranged downstream of a semiconductor relays 24 and able to shut off an electric power supply and a third wiring pattern P3 arranged upstream of a shunt resistor 27 and able to detect an overcurrent are placed in adjacent layers in a manner to face each other, and thus, even if the mutually facing portions (laminated portion) of the these two wiring patterns P2 and P3 are subjected to short circuit, an overcurrent caused by the short circuit can be detected by the shunt resistor 27 and the electric power supply to the switching elements 22 can be shut off by the switching elements 22, so that overheating at the second and third wiring patterns P2 and P3 can be avoided.

A rollable display apparatus includes a flexible panel including a main panel with a display and a dummy panel with a wire connected to the display, a housing to accommodate the flexible panel, a rotatable rolling drum in the housing and coupled to a first end of the flexible panel, a supporting base moveable into and out of the housing and coupled to a second end of the flexible panel, and a printed circuit board connected to the second end of the flexible panel, the printed circuit board being on the supporting base.

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

A method for forming a pattern on a substrate structure without using a mask layer and a substrate structure are provided. The method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, forming at least one electrically conductive recess by removing one part of the electrically conductive layer by a machining process so as to form a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, and removing another part of the electrically conductive layer that is reserved below the electrically conductive recess so that the electrically conductive recess forms an electrically conductive groove.