Patent classifications
H05K1/0213
WIRING SUBSTRATE
A wiring substrate includes an insulating layer including a projection and a wiring layer on the projection. The wiring layer includes a first metal layer on an end face of the projection and a second metal layer on the first metal layer. The width of the end face of the projection is different from at least one of the width of the first metal layer and the width of the second metal layer. An inner wall surface and a bottom surface of a depression around the projection are roughened surfaces.
GROUNDING STRUCTURE FOR A PRINTED CIRCUIT BOARD OF AN INFORMATION HANDLING SYSTEM
In one embodiment, a grounding structure for a printed circuit board (PCB) of an information handling system includes: a first ground via electrically coupled to a ground layer of the PCB; a second ground via electrically coupled to the ground layer of the PCB; and a conductive strip electrically coupling the first ground via to the second ground via, the conductive strip providing a vertical ground reference for a signal transferred from a first surface of the PCB to a second surface of the PCB through a signal via disposed on the PCB.
METHOD FOR MAKING AN INTERACTIVE INFORMATION DEVICE AND PRODUCT PRODUCED THEREBY
A method and product produced by the method for forming an interactive information device with a conductively coated panel includes forming a reduced contrast increased light transmitting, conductively coated panel by providing a transparent substrate and applying a transparent, conductive layer on at least one surface of the substrate in a predetermined pattern with at least one area having a conductive layer thereon and a second area without a conductive layer. The method further includes applying a transparent layer of a metal oxide such that the metal oxide layer, such as silicon dioxide, overlies both areas whereby visible contrast between the areas is reduced and light transmission through the coated panel is increased. The coated panel is then attached to an electro-optic display for displaying information when electricity is applied thereto.
Electrically conductive film
The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
MODULAR ELECTRONIC BUILDING SYSTEMS WITH MAGNETIC INTERCONNECTIONS AND METHODS OF USING THE SAME
Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.
Method and arrangement for board-to-board interconnection
A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.
Power and Communication Handguard
The devices and methods described below provide for a forearm handguard for a rifle with multiple integrated power and communication channels that are accessible to any accessory through the different rail interface systems of the handguard. Any suitable rail interface systems may be used.
METHOD FOR DESIGNING BACKREST MOVEMENT MECHANISM AND BACKREST MOVEMENT MECHANISM DESIGNED USING SAME
An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.
PRINTED CIRCUIT BODY
A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.
CATHETER AND MANUFACTURING METHOD THEREFOR
Disclosed is a catheter, especially a catheter for denervation, having an improved head structure and its manufacturing method, which may have a small design, allow convenient production and ensure excellent reproduction. The catheter includes a cylinder member having a hollow formed therein, at least one electrode mounted to the cylinder member to generate heat, and a power supply wire printed on the cylinder member and connected to the electrode to give a power supply path for the electrode.