A semiconductor package includes a first semiconductor die, an encapsulant body of electrically insulating mold compound that encapsulates the first semiconductor die, a plurality of power leads that protrude out of the encapsulant body and form power connections with the first semiconductor die, and a signal lead that protrudes out of the encapsulant body and forms a signal connection with the first semiconductor die, wherein the signal lead comprises a lead adapter retention feature that is configured to form an interlocked connection with a lead adapter that is fitted over an outer end of the signal lead.

An active composite panel assembly is configured to transfer electrical signals from a source to an electrical device. The active composite panel assembly includes a composite layer, and an active layer secured to the composite layer. The active layer is configured to receive and conduct the electrical signals.

A connection structure, of a short bar forming a conductive path and a land on a printed circuit board, in which the short bar includes a plate portion having a flat plate shape and a protrusion protruding in a stepped shape from a surface of the plate portion, the protrusion is threadably fastened to the printed circuit board by a screw inserted into a land-side through hole formed through the land, from an opposite side of the printed circuit board with respect to the protrusion, in a state where a flat surface portion formed, at a position spaced apart from the surface of the plate portion, on an outer surface of the protrusion is in close contact with the land.

Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

A manufacturing method of a set of connectors includes: a step of measuring an emitting direction of light emitted from a plurality of ferrules; a step of grouping the plurality of ferrules into a first group or a second group, based on whether the emitting direction is right or left of a straight line connecting a reference fitting portion closest to the emitting direction of the light and an optical axis; a step of fabricating a plug using the ferrule belonging to the first group; and a step of fabricating a receptacle using the ferrule belonging to the second group.

A semiconductor package includes a metal baseplate having a die attach region and a peripheral region, a transistor die having a reference terminal attached to the die attach region and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the peripheral region and a second side facing away from the baseplate. The multilayer circuit board includes two embedded electrically conductive layers that are separated from the first and second sides by layers of composite fiber, and an embedded dielectric layer disposed between the two embedded electrically conductive layers. The embedded dielectric layer has a higher dielectric constant than the layers of composite fiber.

One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.

A one-surface groove for wiring is formed in a front surface 2a, opposite-surface grooves for wiring are formed in a back surface 2b by protruding core members, and communication parts for allowing the one-surface groove and the opposite-surface grooves to communicate with each other are formed to shape a board section 2 made of a non-conductive resin. After the core members are retracted, a conduction-side resin, which will become conductive, is shaped in the one-surface groove, the opposite-surface grooves, and the communication parts to form front-side wiring 3, communication wirings 4, and back-side wirings 5, whereby a wiring circuit component is provided.

A multi-layered electronic system has: a support substrate which supports at least a primary conductive track and a conductive shorting element, which are electrical isolated from one another. A security layer has at least a conductive security connection and a flexible switch element providing an electrical interruption to the conductive security track. The conductive security connection electrically engages the primary conductive track. The flexible switch element is coplanar with the conductive security connection. A dielectric substrate, to which the security layer is affixed, is secured to the support substrate. The electrical interruption of the conductive security connection is bridged by the switch element contacting the conductive shorting element under an actuation force provided from the direction of the dielectric substrate, the switch element being biased away from the conductive shorting element in the absence of the actuation force.

A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.