An optimized ground (GND) network connection is provided between a Quad Small Form-factor Pluggable (QSFP) connector and a printed circuit board (PCB). The optimized GND network creates a “GND Island” around the signal pads by adding GND cage around the signal pads (at the empty corridor and in front of QSFP pads) and GND TH (ground through hole) vias from both sides of signal pads (at the empty corridor and in front of QSFP pads).

A semiconductor device including a semiconductor module 10A, a semiconductor module 10B that has a lower switching voltage threshold than the semiconductor module 10A, and busbars 331 and 32 that connect the semiconductor module 10A and the semiconductor module 10B in parallel to a common terminal. The semiconductor module 10B is connected at a connection point on the busbar 32 at which the inductance relative to the common terminal is higher than that of the semiconductor module 10A. The semiconductor module 10B with the low threshold voltage is turned ON faster than the semiconductor module 10A with the high threshold voltage for input of a common switching voltage, but can restrict the rising of the current due to the high inductance of the busbar 32, thereby enabling restriction of the current imbalance.

An electronic device includes a flexible substrate, an anisotropic conductive film, and an electronic element. The flexible substrate includes an active area, a bonding pad, and a plurality of protrusions located on the bonding pad. The anisotropic conductive film includes a plurality of conductive particles. The conductive particles are in contact with the protrusions. The anisotropic conductive film is located between the bonding pad of the flexible substrate and the electronic element.

The present invention relates to a camera module, for use in the automobile sector, with a printed circuit board assembly, the printed circuit board assembly comprising at least one printed circuit board and an image sensor; an interface for data transmission, which makes contact with the printed circuit board; a camera module housing, which has a peripheral wall; an interface-side covering element; a compensating element, which is arranged between the peripheral wall and the covering element; the compensating element being designed to seal the camera module housing and compensate for a clearance between the covering element and the peripheral wall. The present invention also relates to a motor vehicle with a camera module according to the invention and also to a method for producing it.

What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

According to some aspects of the present disclosure, power modules having current sensing circuits, and corresponding sensing methods, are disclosed. Example power modules include a printed circuit board (PCB) having a PCB trace, a first sense terminal coupled to the PCB trace at a first location, and a second sense terminal coupled to the PCB trace at a second location such that a resistance between the first and second sense terminals is defined by a resistance of the PCB trace between the first location and the second location. The power module further comprises a control coupled to the first sense terminal and the second sense terminal, the control adapted to measure a voltage between the first sense terminal and the second sense terminal and determine a current through the PCB trace based on the measured voltage and the resistance between the first sense terminal and the second sense terminal.

Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.

Membrane unit for a speaker device, the membrane unit (1) comprising a membrane (2) and at least two coils (3). The respective longitudinal axes of the at least two coils (3) are arranged in parallel along a main axis (A), a main surface being formed perpendicular to the main axis (A). The at least two coils (3) are positioned adjacent to each other and mechanically connected to the membrane (2), the membrane (2) being substantially flat and having a major surface (S) parallel to the main surface. Wiring (4, 5, 6) to the at least two coils (3) is provided at least partly on a flat part of the membrane (2).

A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.

A circuit module includes a circuit board including an insulating layer, first and second signal conductors, a ground conductor, and a ground conductor layer; and an electronic component including first and second signal terminals and a first ground terminal. The ground conductor includes a first strip portion parallel to the first and second signal conductors. When a portion of the first signal conductor parallel to the second signal conductor and the first signal terminal are set as a first signal wiring line and a portion of the second signal conductor parallel to the first signal conductor and the second signal terminal are set as a second signal wiring line, the circuit board includes a first strip portion connection via conductor that connects the first strip portion and the ground conductor layer in a region where the first and second signal wiring lines are parallel to each other.