A display device includes a substantially rigid display panel, a printed circuit board spaced apart from the display panel in a first direction and having at least one angled portion, a flexible member having a first portion connected to the display panel and a second portion spaced from the first portion, the second portion being connected to a first portion of the printed circuit board, and a support attached to the display panel and the printed circuit board to support the printed circuit board.

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”); one or more circuits mounted to the PCB; and a faceplate that including a plurality of plates, angled relative to one another, such that the faceplate includes increased surface area relative to a substantially flat faceplate, wherein at least two plates of the plurality of plates include physical ports each having track lengths to a circuit of one or more circuits, wherein one or more of the physical ports support signals at a rate of at least 100 Gbps. Each plate of the plurality of plates can be flat. Any of the plurality of plates can include physical ports. The physical ports can be pluggable modules. Each type of the physical ports can be a same type on a given plate.

A device having a color photo resist pattern includes a 3D substrate, at least one color photo resist layer and at least one circuit pattern layer. The at least one color photo resist layer is formed on said 3D substrate and forms a visual pattern together. The at least one circuit pattern layer is formed on said visual pattern formed by said at least one color photo resist layer.

Methods and systems for creating a device having a switch trace are disclosed. The systems and methods described herein may include a device that has a chassis, the chassis having a top and a bottom, at least one antenna affixed to the top of the chassis, a first laser direct structuring-fabricated (LDS) trace, a second LDS trace, and a button, the button connected to the first LDS trace and the top of the chassis, wherein the button is configured to contact the second LDS trace when the button is depressed and complete a circuit between the first LDS trace and the second LDS trace upon contact.

A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.

An electronic module includes a first structure including a flat mounting surface on which an integrated circuit is mounted and a wiring surface including a surface including a portion that changes in a direction perpendicular to the mounting surface, a wire connected to the integrated circuit being extended on the wiring surface, a second structure disposed with a dielectric region interposed with respect to the wiring surface of the first structure, a metal pattern being provided on the second structure, and at least one spacer member that equalizes thickness of the dielectric region between the wire and the metal pattern in an entire range between the mounting surface and the wiring surface including the surface including the portion that changes in the direction perpendicular to the mounting surface.

A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.

Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.