A bushing for gas-insulated switchgear has an electrical conductor, which has a longitudinal axis and which is embedded in an insulating material, and a coated electrode that is arranged coaxially spaced apart from the conductor and that is formed from a plurality of segments.

A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

A transmission line includes a substrate including insulator layers, a mounting electrode on a front layer of the substrate, a signal conductor, a first ground conductor, a first connecting electrode that electrically connects the mounting electrode and the signal conductor and is between the signal conductor and the first ground conductor in a laminating direction, a first inter-layer connecting conductor that is electrically connected between the mounting electrode and the first connecting electrode and is bonded to the first connecting electrode, and a second inter-layer connecting conductor that is electrically connected between the signal conductor and the first connecting electrode, is bonded to the first connecting electrode, and does not overlap with the first inter-layer connecting conductor when viewed in the laminating direction. The first ground conductor does not overlap with at least a portion of the first connecting electrode when viewed in the laminating direction.

A cell-contacting system for a battery module having an array of a plurality of battery cells. Cell connectors connect the cell terminals of the battery cells. The signal lines of a printed circuit board connect a signal source of one of the cell connectors to a signal management circuit or a connection interface. A plastics material carrier plate fits onto the battery cell array and has a first receiving region for the printed circuit board and a plurality of second receiving regions for one each of the plurality of cell connectors. The carrier plate has a base plate and frame elements for receiving the printed circuit board and the cell connectors. Snap-action hooks on the frame elements allow the printed circuit board or the cell connectors to be snap-fit into the corresponding receiving regions.

Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

Rotary motors incorporating flexible printed circuit boards are described. A motor may include a stator assembly and a rotor assembly co-radially arranged with the stator assembly and configured to rotate relative to the stator assembly. At least one of the stator assembly and the rotor assembly may include a flexible printed circuit board having a base layer and a plurality of conductive elements formed on the base layer.

A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

A circuit board includes an insulating substrate having a first surface and a second surface opposite to the first surface, a solid conductor located inside the insulating substrate, a first via conductor connected to the solid conductor from a side of the first surface, and a second via conductor connected to the solid conductor from a side of the second surface. The solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other.

A metal foil has a cathode surface on which no linear indentations exist when viewed microscopically, a production method for the same, and a processing method for an electrodeposition drum used for the same. A surface of the electrodeposition drum for producing the metal foil is irradiated with a laser to process this surface into a pattern of repeated curved shapes including a plurality of dot-shaped dents or the like. With this, the pattern of repeated curved shapes is formed on the surface of the electrodeposition drum. The electrodeposition drum thus processed is used as a cathode, supply of electricity is provided between the electrodeposition drum and an anode plate that are soaked in an electrolytic solution to electrodeposit metal on the surface of the drum with an electrolytic reaction, and thereafter, the metal is peeled off from the electrodeposition drum, thereby yielding the metal foil. The metal foil thus obtained has a pattern corresponding to the pattern of repeated curved shapes including a plurality of dot-shaped bumps or the like on the cathode surface thereof.

A printed wiring board includes a first insulating layer, a conductor layer on the first insulating layer, and a second insulating layer formed on the first insulating layer and covering the conductor layer. The conductor layer includes first, second and third circuits, the first circuit has first width of 15 μm or less, the first and second circuits have second space between the first and second circuits such that the second space has second width of 14 μm or less, the first and third circuits have third space between the first and third circuits such that the third space has third width of 20 μm or more, and the first circuit has first lower and upper surfaces, and second and third side walls such that second angle between the second wall and the first lower surface is larger than third angle between the third wall and the first lower surface.