An electrical connector is provided. The electrical connector is connected to the counterpart electrical connector. The electrical connector includes: an insulating housing having an annular portion; a first elastic member provided to the annular portion; and a second elastic member provided to the annular portion, wherein the first elastic member has a first region exposed on an inner surface of the annular portion and configured to contact a first member of the counterpart electrical connector, the second elastic member has a second region exposed on an outer surface of the annular portion and configured to contact a second member of the counterpart electrical connector, and the first elastic member and the first member are electrical contacts and/or the second elastic member and the second member are electrical contacts.

An electrical connector is provided. The electrical connector is to be attached to a cloth in which a conductive pattern is formed. The electrical connector includes an insulating housing having a boss portion provided on a surface of the housing, where the surface is to be in contact with the cloth, and the boss portion is inserted into the cloth; a connection terminal provided to the housing; and a conductive pad provided around the boss portion on the surface of the housing, where the surface is to be in contact with the cloth, and the conductive pad is electrically connected to the connection terminal. The conductive pad has a protrusion protruding in the same direction as the boss portion of the housing protrudes.

A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1=3˜65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2=0.02˜3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3=0.02˜1.0 W/m.K. A circuit board and its manufacturing method are also provided.

A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

A stretchable mounting substrate that includes a first substrate including a stretchable base material and a stretchable wiring on the stretchable base material; a second substrate including a wiring for an electronic component, the second substrate overlapping at least a part of the first substrate in a plan view of the stretchable mounting substrate; and a connection member connecting the first substrate and the second substrate, the connection member including a connection base material and a connection wiring connecting the stretchable wiring of the first substrate and the wiring of the second substrate 20, wherein the connection member is configured to be deformed in accordance with an expansion/contraction direction of the first substrate so that an expansion/contraction ratio of a region of the first substrate overlapping the second substrate in the plan view is larger than an expansion/contraction ratio of the second substrate.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.

Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

Described are electromagnetic shields comprising a substrate, a conductive additive, and a binder incorporated with the conductive additive and deposited on the substrate, and methods of making thereof.

Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.