A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.

A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.

The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.

A wiring substrate is a wiring substrate including a plurality of differential pairs. Each of the differential pairs includes a first signal conductor, a first connection portion connected to the first signal conductor via a first via, a second signal conductor, and a second connection portion connected to the second signal conductor via a second via. The first signal conductor and the second signal conductor are arranged on different planes parallel to a bottom surface of the wiring substrate and overlap in a vertical direction. The first connection portion and the second connection portion are arranged on a top surface of the wiring substrate at a predetermined interval in a signal transmission direction. Adjacent differential pairs among the plurality of differential pairs are arranged at a predetermined interval in the signal transmission direction and at a predetermined interval in a direction perpendicular to the signal transmission direction.

A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

A cable assembly, a signal transmission structure, and an electronic device are provided. The signal transmission structure includes a circuit board (2), a chip (1), and a cable assembly (3). The chip (1) is assembled on one side of the circuit board (2), and the cable assembly (3) is assembled on the other side of the circuit board (2). The cable assembly (3) includes a cable (31), and the circuit board (2) includes a plurality of conductive holes (22). The chip (1) is electrically connected to the cable (31) of the cable assembly (3) by using the conductive hole (22), to transmit a signal of the chip (1) by using the cable (31). In this technical solution, wires do not need to be disposed in a large area inside the circuit board (2).

A wiring substrate includes a substrate, an insulating film stacked on the substrate, an anode pad stacked on a first surface of the insulating film and electrically coupled to an anode of an inorganic light-emitting diode, a cathode pad stacked on the first surface of the insulating film and electrically coupled to a cathode of the inorganic light-emitting diode, and an auxiliary pad provided to the first surface of the insulating film and having electrical conductivity. The auxiliary pad is disposed in a floating state near an end of the anode pad and the cathode pad.