A mounting substrate manufacturing apparatus includes a first FPC-side pressing member 51 configured to press and heat a first mounting component group 31 including one edge side mounting component that is a flexible printed circuit board 13 arranged on one edge in an arrangement direction in which flexible printed circuit boards 13 arranged on an array substrate 11B and thermally press and bond the first mounting component group 31 on the array substrate 11B, and a second FPC-side pressing member 52 arranged next to the first FPC-side pressing member 51 in the arrangement direction and configured to press and heat a second mounting component group 32 including all the flexible printed circuit boards 13 except for the first mounting component group 31 and thermally press and bond the second mounting component group 32 on the array substrate 11B.

An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

A refrigerator and a display for a refrigerator are provided. The display may include a display plate defining an outer appearance of a front surface of the display, a plurality of display portions that displays information of the refrigerator and is formed by an arrangement of a plurality of fine through-holes that pass through the display plate, a plurality of operational interfaces formed on a front surface of the display plate and operated by a touch input, a touch PCB provided on a rear surface of the display plate and including a plurality of touch sensors at positions corresponding to the plurality of operational interfaces, a display PCB on which a LED that radiates light toward the plurality of fine through-holes is mounted, and a display cover provided close to the rear surface of the display plate and on which the touch PCB and the display PCB are mounted.

A refrigerator and a display for a refrigerator are provided. The display may include a display plate defining an outer appearance of a front surface of the display, a plurality of display portions that displays information of the refrigerator and is formed by an arrangement of a plurality of fine through-holes that pass through the display plate, a plurality of operational interfaces formed on a front surface of the display plate and operated by a touch input, a touch PCB provided on a rear surface of the display plate and including a plurality of touch sensors at positions corresponding to the plurality of operational interfaces, a display PCB on which a LED that radiates light toward the plurality of fine through-holes is mounted, and a display cover provided close to the rear surface of the display plate and on which the touch PCB and the display PCB are mounted.

A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.