Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Such a ball grid array may include a plurality of solder balls that are electrically coupled by a non-linear conductive routing. The non-linear conductive routing may include a plurality of routing sections where each of the plurality of routing sections is disposed at an angle to adjacent routing sections.

Provided is an antenna structure configured to wirelessly charge, the antenna structure including an insulating substrate, a coil formed on a first surface of the insulating substrate in a winding structure, the coil being wound a certain number of times in a clockwise and/or a counterclockwise direction around an axis normal to the insulating substrate, a coating layer including a first magnetic material, the coating layer being disposed adjacent to and surrounding the coil in a winding structure corresponding to the winding structure of the coil, and a shielding sheet including a second magnetic material and facing the second surface of the insulating substrate.

A component is disclosed. A component includes an elongated body, with a first end and a second end; and one or more tabs at the first end and the second end, the tabs configured to have a lower tensile strength than other regions of the component.

In an x-ray source, an isolation circuit can isolate bias voltage at a cathode from a bias voltage at an alternating current source (AC source). The isolation circuit can transfer alternating current from the AC source to the cathode. The isolation circuit can be made repeatedly with minimal variation or failed parts, can be light, and can be small. The isolation circuit can include planar transformer(s). Each planar transformer can include a primary trace on a primary circuit board and a secondary trace on a secondary circuit board. The primary trace and the secondary trace can each include a spiral shape. The primary trace can be located in close proximity to the secondary trace such that alternating electrical current through the primary trace will induce alternating electrical current through the secondary trace.

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

A surgical instrument comprising a staple cartridge and at least two independent antenna arrays configured to communicate with the staple cartridge.

An electric motor, at least having a stator and an annular rotor which are arranged next to one another along an axial direction; wherein the stator has a plurality of stator teeth which are arranged next to one another along a circumferential direction and which each extend along the axial direction. At least one coil has at least one turn is arranged on each stator tooth, wherein the at least one turn is electrically conductively connected to a printed circuit board. The printed circuit board is arranged on an end side of the stator and next to the stator along the axial direction. The printed circuit board comprises a plurality of electrical connecting lines via which the at least one turn of each coil is connected at least to other turns or to an electrical connection of the motor.

A semiconductor device includes a die having an input port and an output port. The semiconductor device also includes a multilayer package substrate with pads on a surface of the multilayer package substrate configured to be coupled to circuit components of a printed circuit board. The multilayer package substrate also includes a passive filter comprising an input port and an output port, and a planar inductor. The planar inductor is coupled to a given pad of the pads of the multilayer package substrate with a first via of the multilayer package substrate and to the input port of the die with a second via of the multilayer package substrate. The planar inductor extends parallel to the surface of the multilayer package substrate.