Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

A kirigami enabled manufacturing method and systems are provided. The method includes providing a plurality of substrate units for mounting electronic devices in an initial state; providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector includes one or more foldable areas defined by a plurality of creases and n stretchable layers stacking on one another; folding the one or more foldable areas of the connector along the plurality of creases by 180°; and flipping and expanding the n stretchable layers of the connector into one layer of a planar predetermined pattern connecting the plurality of substrate units. The enabled manufacturing method and systems expand a small area of thin film material to a large area network by the folding and expanding processes.

The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.

An image processing device that processes an image in which a wiring pattern is drawn and outputs the image as raster data in which formation content of wiring print dots is defined for each pixel, includes an input section that receives the image, a scan section that sequentially performs scanning in a scan direction at intervals of the pixel width, a calculation section that calculates an intersection-to-intersection distance in the scan direction based on positions of the intersection points, and a determination section that determines a line width of the wire in the scan direction and determine formation of dots for the determined line width for each pixel based on the intersection-to-intersection distance, the prescribed width, and a line width of an inclination wire which is the line width, in the scan direction, of a wire inclined according to the prescribed angle.

A multi-function rearview device for use with a vehicle includes a housing configured to be attached to the vehicle and to be moveable relative to the vehicle, a rearview element including at least one of a reflective element, a camera and a display element, a bezel formed at an outer portion of the multi-function rearview device surrounding the rearview element, with the rearview element being attached to at least one of the bezel and the housing, one or more light assemblies providing at least one or more light function indications, including a Human Machine Interface (HMI), and at least one sensor, the sensor controlling the one or more light assemblies or the display element.

In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can comprise at least one of 20 to 45 volume percent of the fluoropolymer, 15 to 35 volume percent of the plurality of boron nitride particles, 1 to 32 volume percent of the plurality of titanium dioxide particles, 10 to 35 volume percent of the plurality of silica particles, and 5 to 15 volume percent of the reinforcing layer; wherein the volume percent values are based on a total volume of the dielectric layer.