A method for forming a pattern on a substrate structure without using a mask layer and a substrate structure are provided. The method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, forming at least one electrically conductive recess by removing one part of the electrically conductive layer by a machining process so as to form a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, and removing another part of the electrically conductive layer that is reserved below the electrically conductive recess so that the electrically conductive recess forms an electrically conductive groove.

A touch panel is manufactured by a method that decreases undesirable reflections of external light while improving the visibility of emitted light. The touch panel includes a base layer including an active region responsive to an external touch to generate an electronic signal and a peripheral region adjacent to the active region, and a first conductive pattern disposed on the active region and a second conductive pattern disposed on the peripheral region, each of the first conductive pattern and the second conductive pattern including a conductive layer having an external light reflectivity and a darkening layer disposed over the conductive layer. External light reflectivity of each of the first and second conductive patterns is lower than that of the conductive layer.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

A method for producing a flexible printed circuit board according to an embodiment of the present invention includes a through-hole formation step of preparing a base material including a base film having insulating properties and flexibility and a pair of metal films stacked on both surface sides of the base film, and forming a through-hole in the metal film on a front surface side of the base material and the base film; a filling step of stacking, by electroplating on a front surface of the base material, stacking a conductive material on a surface of the metal film on the front surface side to form a conductive material layer and to fill the through-hole with the conductive material; and a removal step of removing, by etching the front surface of the base material, a surface layer of the conductive material layer stacked on the surface of the metal film on the front surface side and a surface layer of the conductive material filling the through-hole.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal foils to expose the insulating plate so that a plurality of stripes are arranged on both sides of the insulating plate in parallel at constant intervals, wherein the stripes expose the insulating plate at constant widths; and a third step of cutting in direction in parallel with the stripes and in direction in vertical with the stripes along one edges of the stripes to complete the gap supporter.

Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).