A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material. The via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

The invention relates to a stretched polymer film made of a polyamide composition comprising a semi-crystalline semi-aromatic polyamide (PPA), wherein the PPA consists of repeat units derived from aromatic dicarboxylic acid comprising at least 80 mole % of terephthalic acid, relative to the total amount of aromatic dicarboxylic acid; and diamine comprising at least 5 mole % 1,4-butanediamine and at least 5 mole % 1,6-hexanediamine, relative to the total amount of diamine, the combined amount of 1,4-butanediamine and 1,6-hexanediamine being at least 60 mole % relative to the total amount of diamine; and 0-2 mole % of other monomeric units, relative to the total amount of aromatic dicarboxylic acid, diamine and other monomeric units. The invention further relates to a process for preparing the polyamide film by melt extrusion and stretching of the film.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

The invention provides a printed circuit board assembly (1) comprising (i) an at least partly folded flexible printed circuit board (100), and (ii) an at least partly folded support (200), wherein:—the at least partly folded flexible printed circuit board (100) comprises a first PCB region (110) and a second PCB region (120), wherein at least part of the second PCB region (120) is configured folded over at least part of the first PCB region (110);—the at least partly folded support (200) is configured to support at least part of the at least partly folded flexible printed circuit board (100), wherein the at least partly folded support (200) comprises a first support region (210) and a second support region (220), wherein at least part of the second support region (220) is configured folded over at least part of the first support region (210), wherein at least part of the at least partly folded flexible printed circuit board (100) is configured between the first support region (210) and the second support region (220), and wherein the at least partly folded support (200) is configured to maintain the at least partly folded flexible printed circuit board (100) folded.

A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.

A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.

A method and apparatus for inputting a plurality of different circuit schematics designed with printed circuit board (PCB) mountable components; extracting circuit topologies for said plurality of different circuit schematics; transforming said extracted circuit topologies to a fixed number of connection points; and generating a configurable circuit PCB physical layout pattern having said fixed number of connection points such that said PCB mountable components when positioned on one or more of said fixed number of connection points can implement any circuit represented by said plurality of different circuit schematics.

An encapsulated assembly of electronic componentry, suitable for incorporation into a textile or a yarn, and the assembly comprising two flexible substrates (3, 4) which encapsulate the electronic componentry, at least one of the flexible substrates comprising at least one preformed relief region (3a), which provides a volume which at least in part accommodates the electronic componentry, and the componentry located substantially at a neutral axis (N) of the assembly.

Disclosed are insert-molded electronic modules that include an electrical/electronic component and a heat sink that interlocks with, and optionally also encapsulates, the electrical/electronic component to provide thermal management for the component. The heat sink is formed using a thermally conductive thermoplastic polymer composition and replaces the potting compound and thermal interface material typically used in such assemblies. The electrical/electronic component includes openings that allow the thermally conductive thermoplastic polymer composition to flow therethrough and interlock with the electrical/electronic component. The electronic module may include an insert positioned between the electrical/electronic component and the heat sink, wherein the insert includes holes that allow the conductive thermoplastic polymer composition to flow therethrough and interlock with the insert.