A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

Provided are a device and method for molding an FPC and a plastic part, which belongs to the field of FPC processing technology. The method for molding an FPC and a plastic part includes preprocessing a preform and connecting an FPC to the outer cylindrical surface of the preform; and forming a coating on the outer cylindrical surface of the preform by using the device for molding an FPC and a plastic part.

A laminate comprising a substrate; and a plating-forming layer disposed on at least one surface of both surfaces of the substrate and containing a thermoplastic resin and a plating catalyst, wherein the plating-forming layer further satisfies conditions of the following (1) and/or (2),

(1) the plating-forming layer contains a dispersing agent for dispersing the plating catalyst
(2) an abundance of the plating catalyst on a surface side of the plating-forming layer is higher than an abundance of the plating catalyst on the substrate side of the plating-forming layer.

A method for producing an elastomeric component, preferably an elastomeric sealing component, including an elastomer body and a printed structure, preferably a printed electronic structure or circuit, on a surface of the elastomer body. The method includes: a. providing a planar foil of thermoplastic material having a printable surface; b. printing a structure onto the printable surface to obtain the printed structure; c. providing an elastomer substrate for forming the elastomer body; d. placing the planar foil with the printed structure onto the elastomer substrate; and e. laminating the combined planar foil and elastomer substrate by applying heat and pressure. The elastomeric component is obtained in that the elastomer substrate is formed to the shape of the elastomer body before step d); the elastomer substrate is formed to the shape of the elastomer body during lamination; or the elastomer substrate is formed to the shape of the elastomer body after lamination.

A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

A camera module includes a housing, a lens, an assembly, a terminal, and an electronic component. The housing includes a front surface part, a rear surface part on the opposite side to that, and a side surface part connecting the front surface part and the rear surface part. The lens is exposed from the front surface part. The assembly includes an image sensor and is located on the rear surface part side relative to the lens. The terminal is located at the rear surface part for connection with an outside part. A flexible board includes a part extending from the assembly toward the terminal. The electronic component is mounted on the flexible board.

A backlight assembly and a display device are provided. The backlight assembly includes a light guide plate, a light source, and a first reflector sheet. The light guide plate includes a bottom surface and a light emitting surface opposite to each other, and a light incident surface intersecting the bottom surface and the light emitting surface. The light source is on the light incident surface of the light guide plate. The first reflector sheet is on the bottom surface of the light guide plate and at an end of the light guide plate distal to the light source. The backlight assembly further includes a second reflector sheet proximal to the light source. The second reflector sheet is on the bottom surface and/or the light emitting surface of the light guide plate, and a reflectivity of the second reflector sheet is greater than 90%.

A battery connection module is used to connect a plurality of batteries, the battery connection module includes a carrying tray, a plurality of busbars, a first circuit board, a second circuit board and a bridging circuit board. The plurality of busbars are assembled on the carrying tray, the plurality of busbars are used to connect the plurality of batteries in series. The first circuit board is used to connect the plurality of busbars. The second circuit board is separated from the first circuit board and includes a plurality of electronic elements. The bridging circuit board is used to bridge the first circuit board and the second circuit board. The bridging circuit board includes a plurality of fuses thereon.