Systems and methods are disclosed for integration of an electrically functional structure in an information handling system. An information handling system may include may include a housing including a first housing portion coupled to a second housing portion. The first housing portion may include an electrically functional structure integrated within the first housing portion. The first housing portion may also include a first layer and a structural adhesive applied to the first layer. The first housing portion may further include a second layer and a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer. The first housing portion may also include a PCB layer coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, and the electrically functional structure includes the first PCB and the second PCB.

A pressure-sensitive adhesive sheet-including wiring circuit board includes a wiring circuit board including a base insulating layer, a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer, and a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board.

A first embodiment of the present invention provides a flexible printed circuit board (FPCB) comprising a hot melt adhesive layer and a metal foil layer sequentially stacked on an insulating layer made of a PCT film; a flexible copper clad laminate (FCCL) having a circuit pattern on the metal foil layer; a coverlay adhered to the hot melt adhesive layer formed on the insulating layer made of the PCT film while covering the metal foil layer and also provides a method of manufacturing the FPCB. A second embodiment of the present invention provides an FPCB having a pressure-sensitive adhesive layer instead of the hot-melt adhesive layer, and a method for manufacturing the FPCB having the same, and the third embodiment of the present invention provides an FPCB having a UV cured layer instead of a hot melt adhesive layer, and a method for manufacturing the FPCB having the same.

A PCB laminate material includes at least one polymer layer and at least one inorganic layer, such that the PCB laminate material has a dielectric loss tangent of less than 610.sup.3 at 10 GHz (or higher frequency). The inorganic layer or layers of the PCB laminate material may comprise silica-based materials (including silica fabrics), low-loss glass with a dielectric loss tangent of about 0.006 at 10 GHz (or higher frequency), glass-ceramics, or ceramic materials (e.g., alumina). PCB laminate materials may also include at least one fluoropolymer layer. PCB laminate materials described herein combine good dielectric performance (i.e., low dielectric loss), dimensional stability at elevated temperature (e.g., at 260 C. for 30 seconds), and sufficient mechanical strength to permit handling during production. Printed circuit boards comprising the PCB laminate materials and methods for making the same are also disclosed herein.

A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa.Math.s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.

Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.

Disclosed herein are devices comprising stretchable 3D circuits and methods for fabricating the circuits. The fabrication process includes providing in the elastomeric polymer as a substrate and providing conductive interconnects within the substrate encased in an insulating polymer, such as polyimide, to provide a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit may be fabricated as a multilayer construction using three-dimensional pillars as vias and as external interconnects to the circuit.

The present disclosure relates to a manufacturing method of a continuous sheet for circuit board production providing reel type laminates in a roll-to-roll continuous process without a belt press by connecting at least two or more sheet type metal laminates using an adhesion substrate which includes a reinforcement film and a conductor, the manufacturing method providing improved mechanical properties, and excellent chemical resistance and productivity, and the continuous sheet for circuit board production manufactured therefrom.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.