A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.

A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

An apparatus which includes: a circuit board having a radiofrequency (RF) structure at a first location thereof, the RF structure formed from a conductive trace of the circuit board; a heat carrier; and a multi-stack cooling structure coupling the circuit board and the heat carrier to each other. The multi-stack cooling structure including a first stack adjacent the RF structure at the first location and a second stack at a second location. The first stack including a dielectric layer adjacent the heat carrier, and a thermal interface material (TIM) that couples the dielectric layer and the circuit board to each other, the dielectric layer having higher thermal conductivity and higher rigidity than the TIM. The second stack including a metal layer adjacent the heat carrier, and the TIM that couples the metal layer and the circuit board to each other.

An optical module with enhanced heat-dissipating properties and a method for manufacturing the optical module discloses an optical module which includes a substrate, a printed circuit, a component mounting block, an active device, and a lens. The printed circuit is formed on the substrate. The component mounting block is provided on the substrate, and the component mounting block has a recess. The active device, including a laser or a photodetector, is disposed in the recess. The lens is disposed on the active device.

An optical module with enhanced heat-dissipating properties and a method for manufacturing the optical module discloses an optical module which includes a substrate, a printed circuit, a component mounting block, an active device, and a lens. The printed circuit is formed on the substrate. The component mounting block is provided on the substrate, and the component mounting block has a recess. The active device, including a laser or a photodetector, is disposed in the recess. The lens is disposed on the active device.

A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a AgCu eutectic structure layer (32) is set to 15 m or less.

A method for producing a laminate that includes at least the following: providing a first intermediate laminate comprising a carrier substrate including a support therein and a peelable metal layer formed on at least one surface of the carrier substrate; forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support in the carrier substrate from a surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole; stacking and disposing on the surface where the first hole is formed of the second intermediate laminate, an insulating material and a metal foil in this order when viewed from the surface; and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction thereof with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material; and performing treatment with a chemical agent on the third intermediate laminate.

A display panel and a display are provided. The display panel includes a glass substrate, at least one driving chip and a flexible printed circuit, wherein the at least one driving chip is electrically connected to the flexible printed circuit. Both the at least one driving chip and the flexible printed circuit are arranged on the glass substrate together to reduce the thickness of the display.

A method is provided of producing a rigid raft comprising electrical conductors enclosed in the raft. The method includes: providing a cured, composite material base layer; laying up electrical conductors on the base layer; and overlaying the laid-up electrical conductors with a cover layer, thereby producing a rigid raft in which the electrical conductors are enclosed in the raft.

Lighting modules and methods of manufacturing the same. The lighting module described herein may include a flexible printed circuit board substrate, light emitting diodes mounted on one side of the printed circuit board substrate, and thermally-conductive substrate plates opposite of the light emitting diodes to provide structural support and thermal management.