Provided are a photocurable composition having high filling property and capable of reducing a mold release force upon production of a film through the utilization of a photo-imprint method, and a method of manufacturing a film using the photocurable composition. The photocurable composition is a photocurable composition, including at least the following component (A) to component (C): (A) a polymerizable compound; (B) a photopolymerization initiator; and (C) a surfactant represented by the following general formula (1):
Rf.sub.1-Rc-X.(1)

The present disclosure relates to a method of manufacturing a layer structure for a component carrier. According to the method, a carrier layer is provided. An imprint resist layer is added onto the carrier layer and predefined structures forming at least one recess are stamped into the imprint resist layer by a predefined stamp. The recess defines a filling structure in or on the carrier layer. In the filling structure at least one of an electrically insulating material and an electrically conductive material is filled.

A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

There are provided a photosensitive resin composition which can be applied to either a projection exposure or direct-write exposure machine without fine adjustment of the composition, and can form a resist pattern having an excellent cross-sectional shape in which an undercut in which the bottom portion of the resist pattern is hollowed and omission of the top of the resist pattern are less likely to occur, and a line width of an intermediate portion (central portion) and a deepest portion (bottom portion) in the depth direction of the cross section of the resist pattern is less likely to be larger than a line width of the surface portion (that is, linearity in the depth direction of the resist pattern contour is favorable), and which has excellent insulation reliability and crack resistance reliability, and a dry film using the same, a printed wiring board, and a printed wiring board manufacturing method. The photosensitive resin composition includes an acid-modified vinyl group-containing epoxy resin (A), a photopolymerization initiator (B), a photopolymerization sensitizer including a benzophenone compound (C), and a photopolymerizable compound (D).

A resin composition for laser processing which is able to enhance laser processability with maintaining a resist performance of a resin after ultraviolet laser processing, and which can be, for example, used as a resist in forming a circuit of a printed wiring board is provided. Disclosed is a resin composition for laser processing containing a resin and an ultraviolet absorber, wherein the resin is a thermoplastic resin having a carboxyl group and having a softening temperature of from 70 to 140 C., and a content of the ultraviolet absorber is from 1 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin.

Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline soluble UV blocking composition is selectively applied to the surface of the UV blocking film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.

A method of forming an electronic device on a flexible substrate without using acetone dissolvent, including the steps of: printing a hydrophobic mask on a porous membrane to form a pattern thereon which is complementary to a desired pattern; filtering an aqueous suspension of an electronic material through the non-printed region of the porous membrane, whereby some electronic material is deposited on said non-printed region following the desired pattern; pressing the flexible substrate against the printed face of the membrane in order to transfer the patterned electronic material deposited on the porous membrane to the flexible substrate to form the electronic device thereon.

Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline strippable UV blocking composition is selectively applied to the surface of the UV transparent film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.

The present invention includes the steps of applying a liquid deposition material on a display surface of a display panel through a metal mask which is in close contact with the display surface of the display panel, while heating the metal mask; and forming thin film patterns by heating and baking the applied liquid deposition material.

Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.