A fabrication method of a circuit includes drilling holes in a substrate, so as to form a plurality of first opening holes and second opening holes in the substrate. A cover film is attached onto the substrate, so as to cover the first opening holes and the second opening holes. A portion of the cover film covering the first opening holes is removed, so as to expose the first opening holes. The first opening holes are filled.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.

A ceramic substrate is provided in which an inclined protrusion is formed on boundary surface of a metal layer bonded to a ceramic base so as to increase bonding strength; and a manufacturing method therefor. The inclined protrusion may include: a tapered protrusion and a multi-stepped protrusion formed on the boundary surface of the metal layer according to an interval between the metal layer bonded to the ceramic base and a neighboring metal layer, wherein a multi-stepped protrusion having an inclination angle within a predetermined angle range with respect to the ceramic base may be formed on the boundary surface of the metal layer where stress is concentrated, such as the short edge, apex, corner, and the like, and a tapered protrusion may be formed on a remaining portion of the boundary surface of the metal layer.

An automated masking system includes a substrate loading apparatus designed to hold a plurality of substrates, a first masking material application station designed to automatically apply a first masking material to a portion of the substrate, and a second masking material application station designed to automatically apply a second masking material to a portion of the substrate, the second masking material being different than the first masking material. The system includes a first dispensing apparatus and a second dispensing apparatus that move relative to the substrate in a repeatable motion. The substrate moves automatically from the first masking material application station to the second masking material application station.

A landless multilayer circuit board includes a first substrate, a first circuit, at least one connecting pillar, a second substrate, and a second circuit. The second substrate is on the surface of the first substrate, covering the first circuit, and exposing at least one top of the at least one connecting pillar exposed out of a surface of the second substrate, wherein an area of a portion of the at least one connecting pillar that is exposed out of the surface of the second substrate is greater than an area of a portion of the at least one connecting pillar that is connected to the first circuit. The second circuit is on the surface of the second substrate and the at least one connecting pillar, and connected to the portion of the at least one connecting pillar that is exposed out of the surface of the second substrate.

A multilayer wiring board having a high degree of freedom of wiring design and realizing high-density wiring, and a method to simply manufacture the multilayer wiring board is provided. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically connected to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

A mask material is readily discernible from a substrate to which the mask material is applied. The mask material may have a discernible characteristic, such as its color, luminescence or the like, which may render it visibly distinct from the substrate or detectable using automated inspection equipment. The discernible characteristic of the mask material may render it detectable through a protective coating.

There are provided a composition for forming an underlayer film for imprints which imparts excellent uniformity in thickness of a film to be formed, has excellent wettability with respect to a curable composition for imprints, and imparts stability in a film to be formed; a kit; a curable composition for imprints; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for producing a circuit board. A composition for forming an underlayer film for imprints includes a polyfunctional (meth)acrylate that includes at least one aromatic ring or aromatic heterocyclic ring and has a viscosity of 11 to 600 mPa.Math.s at 23 C. and a molecular weight of 200 or more, and a solvent.

A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.

Provided are: a kit of a composition for forming an underlayer film for imprints and a curable composition for imprints, which is capable of forming a uniform underlayer film, while having excellent wettability; and a laminate, a method for producing a laminate, a method for producing a cured product pattern, and a method for producing a circuit board, each of which uses the above-mentioned kit. The present invention relates to a kit including a curable composition for imprints and a composition for forming an underlayer film for imprints, in which the composition for forming an underlayer film for imprints contains a solvent in a proportion of 99.0% by mass or more; the surface tension of the curable composition for imprints and the surface tension of the non-volatile component in the composition for forming an underlayer film for imprints satisfy a predetermined relationship; and the non-volatile component has a boiling point of higher than 300 C. and is liquid at 23 C.