An array of ultraviolet light emitting diodes can cure ultraviolet curable material, such as solder mask or ink, that has been applied to a substrate in connection with fabricating electronic circuit devices. The substrate can be placed in a housing associated with a processing station of a manufacturing operation. A mask or stencil can be positioned adjacent the substrate. The ultraviolet curable material can be applied to the substrate via the mask or stencil, for example using a squeegee. The ultraviolet light emitting diodes can be moved over the substrate to cure the ultraviolet curable material. The substrate with the cured material can be removed from the housing.

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 μm.

An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle θ satisfies 0<θ<1 deg.

A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.

A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength λ.sub.1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength λ.sub.1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).

Apparatus, method, and system for exposing a photosensitive printing plate to radiation, including a plurality of LED point sources configured to emit UV light. The plurality of LED point sources in at least one of a front side set or back side set are controllable in subsets smaller than an entirety of the collective irradiation field corresponding to the respective set. A holder receives the printing plate in a stationary position to receive incident radiation and a controller is configured to control the plurality of LED source subsets. A first LED point source subset is configured to be controlled at a first intensity differing by a factor relative to a second intensity of a second LED point source subset to give the radiation emitted by the respective set an intended degree of homogeneity.

The overall mechanism for creating the exposure may comprise a table having an outer frame 1110 that holds a transparent (e.g. glass) inner portion 1112. The upper 1120 and lower 1122 linear radiation sources (e.g. banks of LED point sources, optionally mounted inside a reflective housing) are mounted on a gantry system or carriage 1130. The radiation sources are connected to a power source, such as an electrical power cord having sufficient slack to extend the full range of motion of the carriage. Tracks (not shown) disposed on the outer frame portion provide a defined path for the gantry system or carriage to traverse. The carriage may be moved on the tracks by any drive mechanism known in the art (also coupled to the power supply and the controller), including a chain drive, a spindle drive, gear drive, or the like. The drive mechanism for the carriage may comprise one or more components mounted within the carriage, one or more components fixed to the table, or a combination thereof. A position sensor (not shown) is preferably coupled to the carriage to provide feedback to the controller regarding the precise location of the carriage at any given time. The control signal output from the controller for operating the radiation sources and for controlling motion of the carriage may be supplied via a wired or wireless connection. The controller may be mounted in a fixed location, such as connected to the table with a control signal cable attached to the sources similar to the power cable, or may be mounted in or on the carriage. The control system and drive mechanism cooperate to cause back/forth relative motion in a transverse direction between the light from the radiation sources and the plate. It should be understood that other embodiments may be devised in which the drive mechanism is configured to move the portion of the table containing the plate past stationary upper and lower linear radiation sources, as well as embodiments in which the radiation sources cover less than the full width of the plate and are movable in both the transverse and longitudinal direction to provide total plate coverage (or the plate is movable in both directions, or the plate is movable in one of the two directions and the sources are movable in the other direction to provides the full range of motion required to cover the entire plate).

A method for exposing a photopolymerization layer comprising photopolymers includes: providing a printed circuit board, with a photopolymerization layer disposed on the top side of the printed circuit board; performing first-instance exposure on the photopolymerization layer, using a UV source and a digital micro-lens device, wherein the UV source is of a power less than 0.2 kW; stopping the first-instance exposure; covering the photopolymerization layer with a mask, with the mask having a bottom side in contact with the photopolymerization layer; and performing second-instance exposure on the photopolymerization layer, using a mercury lamp and the mask, wherein the mercury lamp is of a power greater than 5 kW.

A lithographic exposure system and method for exposing and structuring a substrate coated with a solder resist is provided. The lithographic exposure system having at least one light beam, formed preferably by two or more laser beams of different UV wavelengths, which is deflected relative to the substrate by a variable deflection device, in order to generate structures on the substrate. In particular, the light beam is superimposed, spatially in the image plane and temporally in the exposure, by a spatially limited, high-energy, preferably externally mounted heat source, wherein preferably infrared laser diodes having linear optics are used.