A circuit pattern is quickly created or changed by exposing the circuit pattern on a board without using a photo mask on which the circuit pattern is formed. There is provided a circuit pattern manufacturing apparatus including a forming unit that forms a circuit pattern by irradiating, with a light beam, a circuit pattern forming sheet including an insulating sheet base material layer and a mixture layer made of a mixture containing a conductive material and a photo-curing resin. The forming unit includes, as an optical engine, a housing, a laser diode, a prism mirror, an inclined mirror, a bottom mirror, and a driving mirror.

A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.

Object: To provide an FPC integrated capacitance switch and a method of manufacturing the same, which allow an FPC portion to have high electrical reliability when used in a bent manner and to have wiring lines to be densely arranged. Solution: The FPC integrated capacitance switch includes a transparent flexible substrate (1) including a sensor unit (11) and a tail portion (12), a plurality of electrodes (2) formed on a first main surface (1a) of the transparent flexible substrate (1) and in the sensor unit (11), a plurality of first electrode wiring lines (21), a plurality of second electrode wiring lines (22) arranged and formed in parallel in the tail portion (12) and made of a photoresist including conductive particles, an electromagnetic shield (3) formed on a second main surface (1b) of the transparent flexible substrate (1) overlapping in plan view a region including the plurality of electrodes (2), a pair of first electromagnetic shield wiring lines (31), a pair of second electromagnetic shield wiring lines (32) formed in the tail portion (12) to be arranged in plan view outward of a region including the plurality of second electrode wiring lines (22), the second electromagnetic shield wiring lines (32) being made of a photoresist including conductive particles, and an electromagnetic shield mask (33) formed on the second main surface (1b) of the transparent flexible substrate (1) overlapping in plan view the region including the plurality of second electrode wiring lines (22), the electromagnetic shield mask (33) including a light-shielding metal film.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A reel-to-reel machine to fabricate a printed flexible circuit on the fly, the machine has a plurality of reels, a laser scanner to ablate a metal foil, a source of UV light or heat to curing an adhesive in a coverlay, another source of UV light or heat to debond a sacrificial liner on the fly. There is a depositor to deposit a sintering paste on the fly onto a predetermined spot for a pad on the metal foil. Removal of slugs are also possible on the fly.

A reel-to-reel method of creating pads on a layer of metal sheet or circuitry pattern on the fly. The method includes placing a sintering paste in the intended spots for pads followed by irradiation of the sintering paste by a laser.

A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.

A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.

A near-eye optic includes a substrate having a clear aperture for propagating light. An inconspicuous electrical circuit is supported by the substrate in the clear aperture of the substrate. The inconspicuous electrical circuit includes a plurality of inconspicuous conductive traces disposed in an inconspicuous pattern and electrically coupled to a plurality of inconspicuous electrical components. The inconspicuous pattern may include e.g. an asymmetric pattern, an aperiodic pattern, a pseudo-random pattern, a meandering pattern, a periodic pattern modulated with pseudo-random perturbations, or a non-rectangular pattern modulated with pseudo-random perturbations.

A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.