Depicted embodiments are directed to an Application Specific Electronics Packaging (ASEP) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the batch processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

A method of manufacturing a component carrier is disclosed. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; patterning a front side of the stack using a first photo-imageable dielectric; and patterning a back side of the stack. A component carrier is also disclosed.

A near-eye optic includes a substrate having a clear aperture for propagating light. An inconspicuous electrical circuit is supported by the substrate in the clear aperture of the substrate. The inconspicuous electrical circuit includes a plurality of inconspicuous conductive traces disposed in an inconspicuous pattern and electrically coupled to a plurality of inconspicuous electrical components. The inconspicuous pattern may include e.g. an asymmetric pattern, an aperiodic pattern, a pseudo-random pattern, a meandering pattern, a periodic pattern modulated with pseudo-random perturbations, or a non-rectangular pattern modulated with pseudo-random perturbations.

Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.

A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure. A method includes embedding an electronic component in an electrically insulating core, providing a coupling structure with a conductive connection having a component end and a wiring end, connecting the electronic component directly to the component end, providing a surface portion of the coupling structure with homogeneous ablation properties, patterning the surface portion with recesses and filling the recesses with a wiring structure such that the wiring end is contacted directly.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A protective film of a conductive adhesive, a circuit board and a method for assembling a display device are provided. The protective film of conductive adhesive includes: a basic material layer; and a photoinduced peelable adhesive and a protective layer which are arranged on a first surface of the basic material layer in sequence, and the photoinduced peelable adhesive has a low adhesive force in the exposure of light with a first wavelength. The protective film further includes a light-shielding film located on a second surface of the basic material layer opposite to the first surface.

Disclosed are methods for fabrication of flexible circuits and electronic devices in cost effective manner that can include integration of submicron structures directly onto target substrates compatible with industrial microfabrication techniques. In one aspect, a method to fabricate an electronic device, includes depositing an electrically conductive layer on a processing substrate including a weakly-adhesive interface layer on a support substrate; depositing an insulating layer on the conductive layer to attach to the conductive layer; forming a circuit on the processing substrate by etching selected portions of the conductive layer based on a circuit design; and producing a flexible electronic device by attaching a flexible substrate to the formed circuit on the processing substrate and detaching the circuit and the flexible substrate from the interface layer, in which the flexible electronic device includes the circuit attached to the flexible substrate.