Depicted embodiments are directed to an Application Specific Electronics Packaging (ASEP) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the batch processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A method of mass spectral analysis in an analytical electrostatic trap (14) is disclosed. The electrostatic trap (14) defines an electrostatic field volume and includes trap electrodes having static and non-ramped potentials. The method comprises injecting a continuous ion beam into the electrostatic field volume.

A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

A component carrier for carrying electronic components includes an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The at least one electronic component is electrically contacted directly to the component contacting end. At least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and the wiring contacting end is electrically contacted directly to the wiring structure.

A subtractive method for manufacturing a circuit board with fine interconnect includes steps of disposing a resist film on a metal layer on a surface of a wiring substrate, and performing a dry etching process to etch and penetrate the resist film and form a wiring pattern groove in the metal layer, the depth of the wiring pattern groove is less than the thickness of the first metal layer; further wet etching process is performed, and the metal layer is etched again from the wiring pattern groove to penetrate the metal layer to form wires in the metal layer, and finally the resist film is removed. By first using dry etching to form wiring pattern grooves in the metal layer, the thickness of the metal layer to be removed by wet etching is reduced, thereby reducing side etching generated by the wet etching process and improving the wiring quality.

A printed wiring board includes a lower layer including conductor layers and insulating layers, a conductor layer formed on the outermost insulating layer in the lower layer, and a solder resist layer formed on the conductor layer such that the solder resist layer is covering the conductor layer on the outermost insulating layer, and a two-dimensional code structure formed on the lower layer and including the conductor layer and a portion of the solder resist layer such that the portion of the solder resist layer has openings forming exposed portions of the conductor layer and that the openings of the solder resist layer and the exposed portions of the conductor layer form the two-dimensional code structure. The conductor layer includes a portion corresponding to the two-dimensional code structure such that the portion of the conductor layer has a residual copper rate that allows the two-dimensional code structure to be read.

A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

There may be provided a material deposition method and a material deposition apparatus. The method may include providing a substrate. The method may further include providing a layer of a material in a solid form onto the substrate. The material in the solid form may be loosely interfacing with the substrate. The method may further include irradiating the material in a solid form with a light to melt the material in the solid form to the material in a liquid form at one or more specific areas of the substrate. The method may further include cooling the material in the liquid form to a solidified material on the substrate. The solidified material may form a pattern, at the one or more specific areas of the substrate, that adheres to the substrate.