It is intended to provide an irradiation device that can achieve good starting performance even without encapsulating a starting performance promoting substance into the internal space of a luminous tube in a discharge lamp, and simultaneously, can distinguish whether the discharge lamp is a genuine product or not. An irradiation device (50) is composed of a discharge lamp (110) provided as a light source and an ultraviolet light source (200) irradiating ultraviolet light to the discharge lamp (110) to detect whether the discharge lamp (110) is a genuine product or not in activation of the discharge lamp (110).

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

A circuit board manufacturing system is provided including a drill that may cut through holes in a board material having a dielectric base and an exterior conductive layer to form a user-selected arrangement of the through holes forming conductive vias in a circuit board. A laser light source may generate and direct laser light onto the exterior conductive layer to etch away parts of the exterior layer and form conductive traces in the board material. The laser light source may generate and direct the laser light to etch away the parts of the exterior conductive layer and form electrically disconnected moats around the conductive traces, forming a user-selected pattern of the traces. A controller may control operation of the drill and the laser light source. The circuit board may include the user-selected arrangement of the vias at the through holes and the user-selected conductive traces in the exterior conductive layer.

Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process and forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure. Other embodiments are described and claimed.

A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 m and 1 m. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer.

A method for manufacturing a housing of an electronic device includes providing a substrate, forming a metal plating on a surface of the substrate, and laser-etching the metal plating to form a conductive layer. The conductive layer serves as an antenna radiator or a conductive circuit.

The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.