A touch panel includes a substrate having a display area and a peripheral area. A peripheral circuit is disposed in the peripheral area. The peripheral circuit comprises at least one bonding pad made of a metal layer. A plurality of touch sensing electrodes is disposed in the display area. The plurality of touch sensing electrodes is made of a metal nanowire layer, a film layer disposed on the metal nanowire layer, and a negative-type photosensitive layer disposed on the film layer. The plurality of touch sensing electrodes is electrically connected to the peripheral circuit.

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

An electronic device is disclosed. An electronic device according to an embodiment may include: a first Printed Circuit Board (PCB), a second PCB, a Radio Frequency (RF) transceiver disposed on the first PCB, a Flexible Printed Circuit Board (FPCB) coupled with the first PCB and the second PCB and electrically coupled with the RF transceiver, the FPCB including a transmission line of a wireless communication signal, an amplifier disposed on the second PCB and electrically coupled with the RF transceiver by the FPCB, a first antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a first frequency, and a second antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a second frequency. The first antenna and the second antenna may be disposed closer to the second PCB than the first PCB in the electronic device. The amplifier may amplify a wireless communication signal received from the first antenna and second antenna.

A system and method for making vias in a laminated printed circuit board (PCB). A drill having both a mechanical drill and a laser drill is used to make the via. The mechanical drill is moved over a location in the PCB where a blind via is desired. The mechanical drill drills to a point where a tip of a bit of the mechanical drill is a predetermined distance above a target interconnect layer. Then the drill is moved such that the laser drill is located over the via where the mechanical drill had drilled the via. The laser drill then ablates the resin remaining above the target interconnect layer.

Apparatus and methods for printing metal on a receiving substrate in a desired geometry using a foil pre-coated with a layer of material. The deposition process includes laser ablation to define desired material geometry, selective application of adhesive to the material to be deposited, and selective release of the material from a carrier substrate.

Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

A near-eye optic includes a substrate having a clear aperture for propagating light. An inconspicuous electrical circuit is supported by the substrate in the clear aperture of the substrate. The inconspicuous electrical circuit includes a plurality of inconspicuous conductive traces disposed in an inconspicuous pattern and electrically coupled to a plurality of inconspicuous electrical components. The inconspicuous pattern may include e.g. an asymmetric pattern, an aperiodic pattern, a pseudo-random pattern, a meandering pattern, a periodic pattern modulated with pseudo-random perturbations, or a non-rectangular pattern modulated with pseudo-random perturbations.

A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.