A component carrier for electrical/electronic parts for attachment in a motor-vehicle door lock. Said component carrier is equipped with at least one carrier plate of plastic and with a metal conducting-track structure for electrically contacting the parts. According to the invention, the conducting-track structure and the carrier plate are produced in a combined plastic injection-molding and metal casting method.

A method includes stacking a first layer of insulating material having one or more passages on a substrate. A deformable conductive material is deposited in at least one of the passages in the first insulating layer. A second layer of insulating material is stacked on the first layer of insulating material. The second layer of insulating material at least partially encloses the deformable conductive material in the at least one passage in the first layer of insulating material, and unitizing the first and second layers in a unitizing operation

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E-9 Ω*m to about 742.5×E-9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor.

An integrated circuit (IC) package is described. The IC package includes a metallization structure. The IC package also includes a first die in a package substrate layer. The package substrate includes a first surface and a second surface, opposite the first surface. The second surface of the package substrate layer is on the metallization structure. The IC package further includes a second die on the first surface of the package substrate layer and on the first die. The IC package also includes through vias in the package substrate layer to couple pads of the second die to metal routing layers at a first surface of the metallization structure. The IC package further includes package bumps on a second surface of the metallization structure, opposite the first surface, and coupled to the pads of the second die through the metal routing layers.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

A manufacturing apparatus of a wiring board includes: a fixed die; a movable die configured to abut with the fixed die so as to form a cavity in which a resin substrate having a wiring gutter is to be molded; and an injection machine configured to inject molten resin into the cavity via the fixed die. The movable die includes a movable main mold, and a movable core having a nested structure in which the movable core is slidably accommodated in the movable main mold. A wall surface of the movable core has a projection portion that molds the wiring gutter. An injector configured to inject molten metal into the wiring gutter via the projection portion is provided inside the movable core.

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels.

A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.

A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.