An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×10.sup.12 ohms to about 1×10.sup.18 ohms as determined in accordance with ASTM D257-14.

The head (1) for the three-dimensional printing of molten metal comprises a hollow body (2) comprising: a first chamber (3) adapted to contain a molten metal (4) in which a dispensing opening (5) is formed for the dispensing of the molten metal (4); a second chamber (9) adapted to contain an operating fluid (10) and connected to pressure variation means (11) adapted to define a pressure difference between the first chamber (3) and the second chamber (9); and a dispensing assembly (12, 13) comprising a flexible laminar element (12) separating the first chamber (3) and the second chamber (9), the laminar element (12) being deformable by means of a pressure variation in the second chamber (9) and the deformation of the laminar element (12) determining the outflow of the molten metal (4) from the dispensing opening (5).

An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.

Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor.

An interior member for a vehicle includes: a base material formed of a resin; a front surface portion configured to constitute a portion of a design surface in a vehicle cabin and cover a surface of the base material that is on the design surface side; and a conductive portion integrally provided with the base material in a state where a portion of the conductive portion that is opposite to the design surface is in close contact with the base material and a portion of the conductive portion that is on the design surface side faces the front surface portion such that power is supplied to an electrical component installed in the vehicle through the conductive portion, the conductive portion being formed of a metal.

Methods, systems, and apparatus for fabricating a circuit board. The method includes fabricating, using an additive manufacturing device, a trace layer, a sacrificial layer, a rail layer and a lid. The method includes placing the sacrificial layer on the trace layer such that the raised traces protrude through corresponding openings of the sacrificial layer. The method includes depositing a conductive material on top of the sacrificial layer and the plurality of traces. The method includes removing the sacrificial layer from the trace layer and placing the rail layer on the trace layer such that the raised traces align with the corresponding openings of the rail layer. The method includes connecting one or more electrical components and melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections and to provide protection. The method includes placing the lid on top of the sealing sheet.

An electronic device of a vehicle part of a motor vehicle includes at least one housing having at least one base surface of the vehicle part and a cover piece attached on the base surface, which in the attached state delimits an almost completely closed cavity, at least one first retaining means of a first surface of the vehicle part through which the housing is fixed in or on the vehicle part, and at least one electronic module including at least one conductor unit and at least one contact means connected with the conductor unit.

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels.

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels.