A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.

An internal multi-function rearview device for use with a vehicle includes a rearview element comprising at least one of a reflective element, a camera, or a display element; a housing configured to be attached to the vehicle and configured to be moveable relative to the vehicle; a bezel configured to be affixed to an opening defined by the housing and configured to surround the rearview element; and a foot configured to be fixed to the vehicle and relative to which the housing and bezel is moveable. The bezel is coated and a coating of the bezel is at least one of a decorative coating, an advanced surface technology, or a spectrally controlling system, and the rearview element is coupled to at least one of the bezel or the housing.

A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

Methods, systems, and apparatus for fabricating a circuit board. The method includes fabricating, using an additive manufacturing device, a trace layer, a sacrificial layer, a rail layer and a lid. The method includes placing the sacrificial layer on the trace layer such that the raised traces protrude through corresponding openings of the sacrificial layer. The method includes depositing a conductive material on top of the sacrificial layer and the plurality of traces. The method includes removing the sacrificial layer from the trace layer and placing the rail layer on the trace layer such that the raised traces align with the corresponding openings of the rail layer. The method includes connecting one or more electrical components and melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections and to provide protection. The method includes placing the lid on top of the sealing sheet.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.

An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

A method of producing a film includes: a disposing step of disposing a photocurable composition on a substrate; a mold contact step of bringing the photocurable composition and a mold into contact with each other; a photoirradiation step of irradiating the photocurable composition with light to form a cured product; and a mold release step of releasing the cured product and the mold from each other, in which the method further includes an alignment step of aligning the mold and the substrate with each other before the photoirradiation step, in which the photocurable composition contains at least a polymerizable compound serving as a component (A) and a photopolymerization initiator serving as a component (B), and in which the polymerizable compound has a polymerization conversion ratio of 50% or more when exposed to light under conditions of an illuminance of 0.12 mW/cm.sup.2 and an exposure time of 11.0 seconds.