A component carrier for electrical/electronic parts for attachment in a motor-vehicle door lock. Said component carrier is equipped with at least one carrier plate of plastic and with a metal conducting-track structure for electrically contacting the parts. According to the invention, the conducting-track structure and the carrier plate are produced in a combined plastic injection-molding and metal casting method.

A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.

An electronic device of a vehicle part of a motor vehicle includes at least one housing having at least one base surface of the vehicle part and a cover piece attached on the base surface, which in the attached state delimits an almost completely closed cavity, at least one first retaining means of a first surface of the vehicle part through which the housing is fixed in or on the vehicle part, and at least one electronic module including at least one conductor unit and at least one contact means connected with the conductor unit.

An interior member for a vehicle includes: a base material formed of a resin; a front surface portion configured to constitute a portion of a design surface in a vehicle cabin and cover a surface of the base material that is on the design surface side; and a conductive portion integrally provided with the base material in a state where a portion of the conductive portion that is opposite to the design surface is in close contact with the base material and a portion of the conductive portion that is on the design surface side faces the front surface portion such that power is supplied to an electrical component installed in the vehicle through the conductive portion, the conductive portion being formed of a metal.

A wiring body includes a main body portion including a first layered portion. The first layered portion includes a resin portion and a conductor portion disposed on the resin portion. The wiring body further includes an overcoat portion disposed on the main body portion and that covers the conductor portion. Surface roughness of a first main surface of the main body portion is greater than surface roughness of a second main surface of the overcoat portion. The first main surface is on a side opposite to the overcoat portion, and the second main surface is on a side opposite to the main body portion.

An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.

A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.

A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.

A manufacturing apparatus of a wiring board includes: a fixed die; a movable die configured to abut with the fixed die so as to form a cavity in which a resin substrate having a wiring gutter is to be molded; and an injection machine configured to inject molten resin into the cavity via the fixed die. The movable die includes a movable main mold, and a movable core having a nested structure in which the movable core is slidably accommodated in the movable main mold. A wall surface of the movable core has a projection portion that molds the wiring gutter. An injector configured to inject molten metal into the wiring gutter via the projection portion is provided inside the movable core.

A plastic component with at least one electrical contact element has a plastic body and at least one electrical strip conductor, by which the electrical contact element can be electrically connected. Provisions are made for the plastic component to be manufactured by a combined injection molding and metal casting method, in which the plastic body is manufactured by an injection molding method and the at least one electrical strip conductor is manufactured by a metal casting or metal injection molding method one after another. The component formed last is molded onto the component formed first. Further, a method for manufacturing a corresponding plastic component is described.