System and method of producing on-demand three-dimensional (3D) printed devices on flexible substrates such as paper, plastic, or polymer using metal alloy nanopowders at low temperatures of printing in the range of 150 degrees Celsius (C) to 300 degrees C. The printer disclosed herein may employ a computer-aided design graphics file given as an input to the printer. The printer will selectively release and print the metal alloy nanopowders on select areas on the substrate to form a conductive pattern.

A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.

A ceramic circuit board includes an insulating substrate composed of stacked insulating layers of an alumina-based sintered body, internal leads containing Cu embedded in the insulating substrate, and one or a plurality of metal layers containing Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to the surface of the insulating substrate in the stacking direction, wherein at least part of the metal layer overlaps the internal leads in plan view.

A three-dimensional (3D) printing method for forming a 3D object layer by layer is provided. The 3D printing method is applicable to a 3D printing apparatus having an input device, and includes: sequentially printing a plurality of layers of the 3D object; obtaining an adjustment signal through the input device when printing a layer of the plurality of layers, where the adjustment signal is used for adjusting a printing parameter; and adjusting the printing parameter for printing another layer of the plurality of layers in response to the obtained adjustment signal. In addition, a 3D printing apparatus using the 3D printing method is also provided.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A preparation process of a copper powder metal plating layer, a metal substrate having the copper powder metal plating layer, an energy-saving anti-burst heat dissipation device and a preparation process thereof; the process of preparing the copper powder metal plating layer comprises the step of attaching the metal layer; the temperature of the liquid in the work tank is kept within a range of 1-15 C.; the attachment process of the metal layer comprises at least the steps of: attaching the bottom layer, attaching the snowflake-shaped layer and attaching the fastening layer.

A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.