An aspect of the present disclosure describes a conductive garment fastening product for a garment, comprising a first article coupleable to a second article for fastening the garment. The first article comprises: a first substrate; an array of first conductive fasteners attached to the first substrate, the array comprising a plurality of rows and a plurality of columns; and a set of first conductive paths disposed conductively along the rows of first conductive fasteners. The first conductive fasteners are engageable with second conductive fasteners of the second article for coupling the first and second articles together and forming a conductive connection therethrough.

Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

Provided are a stretchable wire tape for a textile that can maintain high levels in all of stretchability, electrical conductivity, durability, an insulating property, and design and can also have a reduced production cost, wearable devices, and a method for producing textiles having wires. The stretchable wire tape for the textile includes a stretchable electrically conductive wire, and stretchable insulating films each including a first face and a second face opposite to the first face, the stretchable insulating films being bonded to opposite sides of the stretchable electrically conductive wire on their first faces. Since the stretchable insulating films are bonded to the opposite sides of the stretchable electrically conductive wire via bonding layers, durability and an insulating property can be secured while stretchability and electrical conductivity of the electrically conductive wire can be maintained, and design can also be improved.

In an embodiment a carrier includes a base substrate, at least one insulating layer, at least one inner wiring layer, at least one outer wiring layer and at least one through-via in the insulating layer extending through the insulating layer, wherein the base substrate and the insulating layer are formed from different materials, wherein the base substrate is formed for mechanically stabilizing the carrier and supports the insulating layer, wherein the inner wiring layer is arranged in a vertical direction at least in places between the base substrate and the insulating layer, wherein the outer wiring layer is spatially separated from the inner wiring layer at least in places by the insulating layer, and wherein the through-via electrically conductively connects the inner wiring layer to the outer wiring layer and has a lateral cross-section having a maximum lateral extent of at most 100 μm.

RFID devices comprising (i) a transponder chip module (TCM) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.