Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

According to one aspect of the present invention, a silver nanowire mesh (Ag NW-mesh) electrode and a fabricating method thereof. The Ag NW-mesh electrode includes a flexible substrate; and a mesh pattern layer which is disposed on the flexible substrate and in which a plurality of first meal lines and a plurality of second metal lines are composed of Ag NWs and intersect each other in an orthogonal or diagonal direction to form a grid pattern, wherein the first metal lines and the second metal lines of the mesh pattern layer form an angle of 35 degrees to 55 degrees with respect to a bending direction.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2) The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

The invention relates to a method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed. The method comprises arranging the particles by applying an electric field and/or a magnetic field at an interface between a water soluble or a non-water soluble matrix and a matrix comprising a viscous material and particles. After fixating the viscous material, the termination is exposed by dissolving the water soluble or non-water soluble matrix. The invention also relates to articles obtainable by said method, and to the use of said method in various applications.

A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

A method for manufacturing electrically conductive structures, preferably conductive pathway structures using laser beams on a non-conductive carrier (LDS method), wherein a non-conductive carrier material is provided which contains at least one inorganic metal phosphate compound and at least one stabiliser finely distributed or dissolved therein, the carrier material is irradiated in regions by laser beams generating the electrically conductive structures in the irradiated regions.

The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

A liquid metal-based flexible electron device and a preparation method are disclosed. In the method, 3D printing and the characteristic that ABS plastic can be dissolved by acetone are utilized, and a microchannel is quickly constructed in the flexible substrate of Ecoflex, and liquid metal is then injected into the microchannel to complete the manufacturing of a flexible electronic device. The gold film on the surface of ABS is transferred to the surface of the flexible Ecoflex substrate.

A resin member is formed from a resin material containing filler and an insulating base polymer as a main component. The resin member includes an alignment layer close to a surface of the resin member. The alignment layer includes the filler aligned in the surface direction and the base polymer filling the space between pieces of the filler. The alignment layer includes a carbonized portion that is carbonized matter of the base polymer, contains graphite, and provides electrical conductivity and thermal conductivity.