Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

A method for directly writing metal traces on a wide range of substrate materials is disclosed. The method includes writing a pattern of particle-free metal-salt-based ink on the substrate followed by a plasma-based treatment to remove the non-metallic components of the ink and decompose its metal salt into pure metal. The ink is based on a multi-part solvent whose components differ in at least one of evaporation rate, surface tension, and viscosity, which improves the manner in which the ink is converted into its metal constituent via the plasma treatment. In some embodiments, a microplasma is used for post-treatment of the deposited ink, where the plasma properties are controlled to provide different material properties, such as porosity and effective resistivity, in different regions of the metal pattern.

Method of creating at least a part of an electronic circuit, comprising the steps of providing at least one carbonizable substrate, in particular a cellulose based substrate, and position-selectively irradiating at least one part of the substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad; and device comprising: at least one irradiation source, in particular a laser, such as a CO2 laser, being configured to position-selectively irradiate at least one part of a carbonizable substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad.

Disclosed is a composition comprising: from about 10 wt. % to about 90 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide resin; from about 0.01 to 10 wt. % of a laser direct structuring additive; from about 0.01 wt. % to about 50 wt. % of laser breakable filler, wherein the composition exhibits a dissipation factor of less than 0.01 at frequencies of 1 GHz to 20 GHz frequencies when measured using a dielectric resonator, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.

A resin member is formed from a resin material containing filler and an insulating base polymer as a main component. The resin member includes an alignment layer close to a surface of the resin member. The alignment layer includes the filler aligned in the surface direction and the base polymer filling the space between pieces of the filler. The alignment layer includes a carbonized portion that is carbonized matter of the base polymer, contains graphite, and provides electrical conductivity and thermal conductivity.

Polymer binders, e.g., crosslinked polymer binders, have been found to be an effective film component in creating high quality transparent electrically conductive coatings or films comprising metal nanostructured networks. The metal nanowire films can be effectively patterned and the patterning can be performed with a high degree of optical similarity between the distinct patterned regions. Metal nanostructured networks are formed through the fusing of the metal nanowires to form conductive networks. Methods for patterning include, for example, using crosslinking radiation to pattern crosslinking of the polymer binder. The application of a fusing solution to the patterned film can result in low resistance areas and electrically resistive areas. After fusing, the network can provide desirable low sheet resistances while maintaining good optical transparency and low haze. A polymer overcoat can further stabilize conductive films and provide desirable optical effects. The patterned films can be useful in devices, such as touch sensors.

A resin member is formed from a resin material containing filler and an insulating base polymer as a main component. The resin member includes an alignment layer close to a surface of the resin member. The alignment layer includes the filler aligned in the surface direction and the base polymer filling the space between pieces of the filler. The alignment layer includes a carbonized portion that is carbonized matter of the base polymer, contains graphite, and provides electrical conductivity and thermal conductivity.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)
The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.

An assembly (1) comprises at least one base plate (2), a counter plate (3) connected thereto, and an electro-optical element (4). The base plate (2) is provided with at least one conductor track (7) for connecting the electro-optical element (4), and with at least one heat transfer element (5) for dissipating heat from the electro-optical element (4). The heat transfer element (5) is a heat-conductive operative connection between the electro-optical element (4) and the counter plate (3).