Methods of forming an electrically conductive layer on a flexible substrate, such as a stretchable electrode, by aerosol jet printing on the flexible substrate while the substrate is strained. In general, a stretchable substrate is initially deformed so that a first surface thereof is under tension. While the substrate is in the strained state, an ink is aerosol jet printed onto the first surface. The ink includes carbon nanotubes, and advantageously other materials such as reduced graphene oxide. Further, while the substrate is still in the strained state, the ink is cured after its application to the substrate. Thereafter, the strain is decreased so that the stretchable substrate contracts, self-organizing into a configuration wherein the substrate's first surface, with the cured ink thereon, has a wrinkled profile. The flexible substrate can then be mechanically expanded and contracted, advantageously repeatedly, with the ink layer maintaining electrical conductivity.

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.

A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

A method for forming thin film conductors is disclosed. A thin film precursor material is initially deposited onto a porous substrate. The thin film precursor material is then irradiated with a light pulse in order to transform the thin film precursor material to a thin film such that the thin film is more electrically conductive than the thin film precursor material. Finally, compressive stress is applied to the thin film and the porous substrate to further increase the thin film's electrical conductivity.

The invention relates to the application of electrically conductive bus bars onto a low-emissivity coating of glass. A method of applying electrically conductive bus bars onto a low-emissivity surface of glass is performed by gas dynamic cold spray method with the aid of a spraying nozzle of a gas dynamic spraying apparatus. The method comprises: providing in the gas dynamic spraying apparatus an estimated bulk weight of a powder, sufficient for spraying the powder over the entire length of the bus bar; moving the spraying nozzle to a beginning point of the bus bar without supplying the sprayed powder into the nozzle, and upon positioning the moving nozzle at the beginning point of the bus bar, supplying the sprayed powder into the spraying nozzle and moving the spraying nozzle with a constant speed from the beginning point to an end point of the bus bar. Upon reaching the end point of the bus bar, the movement of the nozzle is reversed towards the beginning point of the bus bar with a speed greater than the speed of the nozzle from the beginning point to the end point of the bus bar.

The invention relates to the application of electrically conductive bus bars onto a low-emissivity coating of glass. A method of applying electrically conductive bus bars onto a low-emissivity surface of glass is performed by gas dynamic cold spray method with the aid of a spraying nozzle of a gas dynamic spraying apparatus. The method comprises: providing in the gas dynamic spraying apparatus an estimated bulk weight of a powder, sufficient for spraying the powder over the entire length of the bus bar; moving the spraying nozzle to a beginning point of the bus bar without supplying the sprayed powder into the nozzle, and upon positioning the moving nozzle at the beginning point of the bus bar, supplying the sprayed powder into the spraying nozzle and moving the spraying nozzle with a constant speed from the beginning point to an end point of the bus bar. Upon reaching the end point of the bus bar, the movement of the nozzle is reversed towards the beginning point of the bus bar with a speed greater than the speed of the nozzle from the beginning point to the end point of the bus bar.