An integrated circuit (IC) die package substrate comprises a first trace upon, or embedded within, a dielectric material. The first trace comprises a first metal and a first via coupled to the first trace. The first via comprises the first metal and a second trace upon, or embedded within, the dielectric material. A second via is coupled to the second trace, and at least one of the second trace or the second via comprises a second metal with a different microstructure or composition than the first metal.

An integrated circuit assembly may be fabricated having an electronic substrate, an integrated circuit device having a first surface, an opposing second surface, at least one side extending between the first surface and the second surface, and at least one through-substrate via extending into the integrated circuit device from the second surface, wherein the first surface of the integrated circuit device is electrically attached to the electronic substrate; and at least one power delivery route electrically attached to the second surface of the integrated circuit device and to the electronic substrate, wherein the at least one power delivery route is conformal to the side of the integrated circuit device and the first surface of the electronic substrate.

A method for adjusting the value of the characteristic impedance Zo of a microstrip transmission line printed on an outer layer of a printed circuit board (PCB) comprises performing a post-manufacturing process directly on the artwork of a production PCB.

A glass wiring substrate includes a glass substrate, a first wiring portion formed on a first surface of the glass substrate, a second wiring portion formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P.sub.1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P.sub.2 of the second wiring portion in the vicinity of the through-hole portion.

A glass wiring substrate includes a glass substrate, a first wiring portion formed on a first surface of the glass substrate, a second wiring portion formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P.sub.1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P.sub.2 of the second wiring portion in the vicinity of the through-hole portion.

A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.

A component carrier with a double layer structure is illustrated and described. The double layer structure includes an electrically conductive patterned layer structure and a further patterned layer structure made of a two-dimensional material. The patterned layer structure and the further patterned layer structure have at least partly the same pattern. In an embodiment the component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and at least one double layer structure connected with the stack.

The present invention discloses a method of manufacturing a diaper that has multiple moisture sensing elements on interior side of its bottom impermeable layer or on any surface of the top permeable layer. The moisture sending elements are made by spraying conductive ink on a moving sheet of either the bottom impermeable layer or the top permeable layer, before other layers of the diaper are attached. Spraying of conductive ink on the moving sheet causes parallel lines of conductive inks to be formed on the layer. The parallel lines of conductive ink run through the entire length of either of the layers and are designed to get connected with a detecting device. When a user urinates inside the diaper, the moisture causes a closed circuit between at least two of the parallel lines of conductive inks. These formations of closed circuits, between parallel lines of conductive inks, are detected by the detecting device. Also, with increasing volume of moisture, the resistance of the closed circuits also tends to decrease. This rate of decrease of resistance is also detected by the detecting device and is used to calculate a volume of moisture present in the diaper. The detecting device then generates a suitable alarm to give an idea about the saturation level of the diaper. The process of manufacturing sensing elements by spraying conductive inks on moving sheet of layer reduces the processing and modification overhead of specially designed conductive ink printers and also does not impact the manufacturing time of a diaper manufacturing assembly line.

The present invention discloses a method of manufacturing a diaper that has multiple moisture sensing elements on interior side of its bottom impermeable layer or on any surface of the top permeable layer. The moisture sending elements are made by spraying conductive ink on a moving sheet of either the bottom impermeable layer or the top permeable layer, before other layers of the diaper are attached. Spraying of conductive ink on the moving sheet causes parallel lines of conductive inks to be formed on the layer. The parallel lines of conductive ink run through the entire length of either of the layers and are designed to get connected with a detecting device. When a user urinates inside the diaper, the moisture causes a closed circuit between at least two of the parallel lines of conductive inks. These formations of closed circuits, between parallel lines of conductive inks, are detected by the detecting device. Also, with increasing volume of moisture, the resistance of the closed circuits also tends to decrease. This rate of decrease of resistance is also detected by the detecting device and is used to calculate a volume of moisture present in the diaper. The detecting device then generates a suitable alarm to give an idea about the saturation level of the diaper. The process of manufacturing sensing elements by spraying conductive inks on moving sheet of layer reduces the processing and modification overhead of specially designed conductive ink printers and also does not impact the manufacturing time of a diaper manufacturing assembly line.

A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.